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1. (WO2018181708) MODULE

Pub. No.:    WO/2018/181708    International Application No.:    PCT/JP2018/013234
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 30 01:59:59 CEST 2018
IPC: H01L 23/28
H01L 23/29
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: MATSUKAWA, Yoshitaka
松川 喜孝
Title: MODULE
Abstract:
Provided is a module which is capable of efficiently dissipating heat that is generated by a mounted component. A module 1a according to the present invention is provided with: a wiring board 2; a component 3a which is mounted on an upper surface 2a of the wiring board 2; a heat dissipation member 5a having a portion that is in contact with the component 3a; and a sealing resin layer 4 which is laminated on the upper surface 2a of the wiring board 2 so as to seal the component 3a and the heat dissipation member 5a. Incidentally, the heat dissipation member 5a is formed into a square tube; and an inner lateral surface 5a1 is in contact with a lateral surface 3a3 of the component 3a. In addition, the upper end of the heat dissipation member 5a is exposed from an upper surface 4a of the sealing resin layer 4 and is connected to a shield film 6, while the lower end is connected to a surface layer electrode 7b of the wiring board 2.