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1. (WO2018181702) ROLL-JOINED BODY FOR ELECTRONIC DEVICES AND CASING FOR ELECTRONIC DEVICES
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/181702 International Application No.: PCT/JP2018/013217
Publication Date: 04.10.2018 International Filing Date: 29.03.2018
IPC:
B32B 15/01 (2006.01) ,B23K 20/04 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
01
all layers being exclusively metallic
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
04
by means of a rolling mill
Applicants: TOYO KOHAN CO., LTD.[JP/JP]; 2-12, Yonban-cho, Chiyoda-ku, Tokyo 1028447, JP
Inventors: SADAKI Kota; JP
KUROKAWA Teppei; JP
HASHIMOTO Yusuke; JP
HATAKEDA Takafumi; JP
KOSHIRO Takashi; JP
Agent: HIRAKI & ASSOCIATES; Atago Green Hills MORI Tower 32F, 5-1, Atago 2-chome, Minato-ku, Tokyo 1056232, JP
Priority Data:
2017-06626829.03.2017JP
2017-14805331.07.2017JP
2017-24686522.12.2017JP
Title (EN) ROLL-JOINED BODY FOR ELECTRONIC DEVICES AND CASING FOR ELECTRONIC DEVICES
(FR) CORPS ASSEMBLÉ AU ROULEAU POUR DISPOSITIFS ÉLECTRONIQUES ET BOÎTIER POUR DISPOSITIFS ÉLECTRONIQUES
(JA) 電子機器用圧延接合体及び電子機器用筐体
Abstract:
(EN) The purpose of the present invention is to provide a roll-joined body for electronic devices, which has high rigidity and a high elastic modulus and is suitably used for a casing. The present invention pertains: to a roll-joined body for electronic devices and casing for electronic devices. The roll-joined body comprises a stainless steel layer and an aluminum alloy layer, wherein the thickness TAl (mm) and the surface hardness HAl (HV) of the aluminum alloy layer and the thickness TSUS (mm) and the surface hardness HSUS (HV) of the stainless steel layer satisfy formula (1): HSUSTSUS2≥(34.96+0.03×(HAlTAl2)2-3.57×HAlTAl2)/(-0.008×(HAlTAl2)2+0.061×HAlTAl2+1.354)
(FR) L'objectif de la présente invention est de fournir un corps assemblé au rouleau pour des dispositifs électroniques, qui présente une rigidité élevée et un module d'élasticité élevé et est utilisé de manière appropriée pour un boîtier. La présente invention concerne : un corps assemblé au rouleau pour des dispositifs électroniques et un boîtier pour des dispositifs électroniques. Le corps assemblé au rouleau comprend une couche d'acier inoxydable et une couche d'alliage d'aluminium, l'épaisseur TA l (mm) et la dureté de surface HA l (HV) de la couche d'alliage d'aluminium et l'épaisseur TSUS (mm) et la dureté de surface HSUS (HV) de la couche d'acier inoxydable satisfaisant la formule (1) : HSUSTSUS 2≥(34,96+0,03×(HA lTA l 2)2-3,57×HA lTA l 2)/(-0,008×(HA lTA l 2)2+0,061×HA lTA l 2+1,354)
(JA) 本発明は、高い剛性及び弾性率を有し、筐体用途に適する電子機器用圧延接合体を提供することを目的とする。 本発明は、ステンレス層とアルミニウム合金層からなる圧延接合体であって、前記アルミニウム合金層の厚みTAl(mm)及び表面硬度HAl(HV)、並びに前記ステンレス層の厚みTSUS(mm)及び表面硬度HSUS(HV)が下記式(1)を満たす電子機器用圧延接合体及び電子機器用筐体に関する。 HSUSSUS≧(34.96+0.03×(HAlAl-3.57×HAlAl)/(-0.008×(HAlAl+0.061×HAlAl+1.354) (1)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)