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1. (WO2018181694) CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/181694 International Application No.: PCT/JP2018/013194
Publication Date: 04.10.2018 International Filing Date: 29.03.2018
IPC:
H01B 1/00 (2006.01) ,C08L 101/00 (2006.01) ,C09J 9/02 (2006.01) ,C09J 11/02 (2006.01) ,C09J 201/00 (2006.01) ,H01B 1/22 (2006.01) ,H01B 5/00 (2006.01) ,H01B 5/16 (2006.01) ,H01R 11/01 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
16
comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11
Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01
characterised by the form or arrangement of the conductive interconnection between their connecting locations
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors:
土橋 悠人 DOBASHI, Yuto; JP
後藤 裕輔 GOTOU, Yuusuke; JP
山田 恭幸 YAMADA, Yasuyuki; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2017-06741530.03.2017JP
Title (EN) CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
(FR) PARTICULES CONDUCTRICES, MATÉRIAU CONDUCTEUR ET STRUCTURE DE CONNEXION
(JA) 導電性粒子、導電材料及び接続構造体
Abstract:
(EN) The present invention provides conductive particles that are capable of effectively enhancing conduction reliability. The conductive particles according to the present invention each have: a first configuration wherein the ratio of 20% K value at 100°C to 20% K value at 25°C is 0.85 or less, and the compression recovery at 25°C is 50-80%, while the compression recovery at 100°C is 40-70%; a second configuration wherein the ratio of 20% K value at 150°C to 20% K value at 25°C is 0.75 or less, and the compression recovery at 25°C is 50-80%, while the compression recovery at 150°C is 25-55%; or a third configuration wherein the ratio of 20% K value at 200°C to 20% K value at 25°C is 0.65 or less, and the compression recovery at 25°C is 50-80%, while the compression recovery at 200°C is 20-50%.
(FR) La présente invention concerne des particules conductrices qui sont capables d'améliorer efficacement la fiabilité de conduction. Les particules conductrices selon la présente invention ont chacune : une première configuration dans laquelle le rapport de 20% de la valeur K à 100 °C à 20 % de la valeur K à 25 °C est de 0,85 ou moins, et la récupération de compression à 25 °C est de 50-80 %, tandis que la récupération de compression à 100 °C est de 40 à 70 % ; une seconde configuration dans laquelle le rapport de 20% de la valeur K à 150 °C à 20 % de la valeur K à 25 °C est de 0,75 ou moins, et la récupération de compression à 25 °C est de 50-80 %, tandis que la récupération de compression à 150 °C est de 25-55 % ; ou une troisième configuration dans laquelle le rapport de 20% de la valeur K à 200 °C à 20 % de la valeur K à 25 °C est de 0,65 ou moins, et la récupération de compression à 25 °C est de 50-80 %, tandis que la récupération de compression à 200 °C est de 20 à 50 %.
(JA) 導通信頼性を効果的に高めることができる導電性粒子を提供する。 本発明に係る導電性粒子は、100℃における20%K値の25℃における20%K値に対する比が、0.85以下、25℃における圧縮回復率が、50%以上、80%以下、100℃における圧縮回復率が、40%以上、70%以下である第1の構成;150℃における20%K値の25℃における20%K値に対する比が、0.75以下、25℃における圧縮回復率が、50%以上、80%以下、150℃における圧縮回復率が、25%以上、55%以下である第2の構成;又は、200℃における20%K値の25℃における20%K値に対する比が、0.65以下、25℃における圧縮回復率が、50%以上、80%以下、200℃における圧縮回復率が、20%以上、50%以下である第3の構成を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN109983543