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|1. (WO2018181686) WARPAGE CORRECTION MATERIAL AND METHOD FOR MANUFACTURING FAN OUT-TYPE WAFER LEVEL PACKAGE|
|Applicants:||TAIYO INK MFG. CO., LTD.
|Title:||WARPAGE CORRECTION MATERIAL AND METHOD FOR MANUFACTURING FAN OUT-TYPE WAFER LEVEL PACKAGE|
[Problem] To provide a warpage correction material which can adjust the amount of warpage even at the temperature at which a fan out-type wafer level package (FO-WLP) is mounted, and at room temperature at which, for example, wafer transportation is performed, and thereby reduce the warpage of the WLP. [Solution] This warpage correction material for a fan out-type wafer level package is characterized by comprising a curable resin composition including a component that is curable by means of an active energy ray and heat, wherein when the warpage correction material is formed into a flat film-shaped cured product by curing the warpage correction material by means of the active energy ray and heat, and the linear expansion coefficient α (ppm/°C) at 25°C, the elastic modulus β (GPa) at 25°C, and the thickness γ (μm) of the cured product satisfy the following relational expression: 2000≤α×β×γ≤10000.