Search International and National Patent Collections

1. (WO2018181686) WARPAGE CORRECTION MATERIAL AND METHOD FOR MANUFACTURING FAN OUT-TYPE WAFER LEVEL PACKAGE

Pub. No.:    WO/2018/181686    International Application No.:    PCT/JP2018/013176
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 30 01:59:59 CEST 2018
IPC: H01L 23/12
C08G 59/62
H01L 23/00
H01L 23/29
H01L 23/31
Applicants: TAIYO INK MFG. CO., LTD.
太陽インキ製造株式会社
Inventors: ITO Hideyuki
伊藤 秀之
SATO Kazuya
佐藤 和也
ARAI Yasuaki
荒井 康昭
Title: WARPAGE CORRECTION MATERIAL AND METHOD FOR MANUFACTURING FAN OUT-TYPE WAFER LEVEL PACKAGE
Abstract:
[Problem] To provide a warpage correction material which can adjust the amount of warpage even at the temperature at which a fan out-type wafer level package (FO-WLP) is mounted, and at room temperature at which, for example, wafer transportation is performed, and thereby reduce the warpage of the WLP. [Solution] This warpage correction material for a fan out-type wafer level package is characterized by comprising a curable resin composition including a component that is curable by means of an active energy ray and heat, wherein when the warpage correction material is formed into a flat film-shaped cured product by curing the warpage correction material by means of the active energy ray and heat, and the linear expansion coefficient α (ppm/°C) at 25°C, the elastic modulus β (GPa) at 25°C, and the thickness γ (μm) of the cured product satisfy the following relational expression: 2000≤α×β×γ≤10000.