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1. (WO2018181661) THERMOELECTRIC CONVERSION DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/181661 International Application No.: PCT/JP2018/013112
Publication Date: 04.10.2018 International Filing Date: 29.03.2018
IPC:
H01L 35/30 (2006.01) ,H01L 35/32 (2006.01) ,H01L 35/34 (2006.01) ,H02N 11/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
30
characterised by the heat-exchanging means at the junction
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
32
characterised by the structure or configuration of the cell or thermo-couple forming the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
34
Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
N
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
11
Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
関 佑太 SEKI, Yuta; JP
原 悠介 HARA, Yusuke; JP
加藤 邦久 KATO, Kunihisa; JP
森田 亘 MORITA, Wataru; JP
武藤 豪志 MUTO, Tsuyoshi; JP
Agent:
大谷 保 OHTANI, Tamotsu; JP
有永 俊 ARINAGA, Shun; JP
石原 俊秀 ISHIHARA, Toshihide; JP
Priority Data:
2017-06880630.03.2017JP
Title (EN) THERMOELECTRIC CONVERSION DEVICE
(FR) DISPOSITIF DE CONVERSION THERMOÉLECTRIQUE
(JA) 熱電変換デバイス
Abstract:
(EN) A thermoelectric conversion device which is provided with: a substrate that has a pair of main surfaces; a thermoelectric element layer which is arranged on one main surface of the substrate, and wherein P-type thermoelectric element layers and N-type thermoelectric element layers are alternately arranged in series so as to be adjacent to each other in the in-plane direction; a connection layer for connecting a plurality of layers, which is arranged so as to cover a surface of the thermoelectric element layer, said surface being on the reverse side of the substrate-side surface; and a highly heat conductive layer which is arranged in a pattern on a surface of the connection layer, said surface being on the reverse side of the thermoelectric element layer-side surface. The thermal conductivity of the highly heat conductive layer is higher than the thermal conductivity of the connection layer; and the thermal conductivity of the connection layer is 1.6 W/(m·K) or less.
(FR) L'invention concerne un dispositif de conversion thermoélectrique comprenant : un substrat qui possède une paire de surfaces principales ; une couche d'élément thermoélectrique qui est disposée sur une surface principale du substrat, et dans laquelle des couches d'éléments thermoélectriques de type P et des couches d'éléments thermoélectriques de type N sont disposées en alternance en série de manière à être adjacentes les unes aux autres dans la direction dans le plan ; une couche de connexion destinée à connecter une pluralité de couches, laquelle est disposée de manière à recouvrir une surface de la couche d'élément thermoélectrique, ladite surface se trouvant sur le côté inverse de la surface côté substrat ; et une couche hautement conductrice de chaleur qui est disposée en un motif sur une surface de la couche de connexion, ladite surface se trouvant sur le côté inverse de la surface côté couche d'élément thermoélectrique. La conductivité thermique de la couche hautement conductrice de chaleur est supérieure à la conductivité thermique de la couche de connexion ; et la conductivité thermique de la couche de connexion est inférieure ou égale à 1,6 W/(m·K).
(JA) 一対の主面を備える基板と、基板の一方の主面上に設けられた、P型熱電素子層とN型熱電素子層とが面内方向に交互に隣接し直列に配置された熱電素子層と、複数の層を連結するための連結層であって、熱電素子層の、基板とは反対側の面を覆うように配置された連結層と、連結層の、熱電素子層とは反対側にパターン配置された高熱伝導層と、を備え、高熱伝導層の熱伝導率は連結層の熱伝導率よりも大きく、連結層の熱伝導率は1.6W/(m・K)以下である、熱電変換デバイス。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)