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1. (WO2018181603) LIQUID EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/181603    International Application No.:    PCT/JP2018/013020
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Mar 29 01:59:59 CEST 2018
IPC: C08G 59/32
C08G 59/50
C08L 63/00
H01L 21/56
H01L 23/29
H01L 23/31
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: HIRAI, Tomoki
平井 友貴
TAKAHASHI, Hisato
高橋 寿登
YAMADA, Kazuhiko
山田 和彦
Title: LIQUID EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Abstract:
A liquid epoxy resin composition comprises an epoxy resin, a curing agent, and a filler; the epoxy resin comprising an epoxy compound having at least three epoxy groups, and the content ratio of the epoxy compound that has at least three epoxy groups to the entire epoxy resin being greater than or equal to 1 mass% of the and less than 10 mass%.