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1. (WO2018181601) EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE

Pub. No.:    WO/2018/181601    International Application No.:    PCT/JP2018/013018
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Mar 29 01:59:59 CEST 2018
IPC: C08L 63/00
C08K 3/22
C08K 3/34
C08K 3/36
C08K 3/38
C08K 5/20
H01L 23/29
H01L 23/31
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: HORI, Keichi
堀 慧地
KAN, Donchoru
姜 東哲
TSUCHIDA, Satoru
土田 悟
YAMAURA, Masashi
山浦 格
TANAKA, Mika
田中 実佳
Title: EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE
Abstract:
Provided is an epoxy resin composition for sealing, the composition containing (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a C17-C50 fatty acid amide compound.