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1. (WO2018181600) EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE

Pub. No.:    WO/2018/181600    International Application No.:    PCT/JP2018/013017
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Mar 29 01:59:59 CEST 2018
IPC: C08L 63/00
C08K 3/22
H01L 23/29
H01L 23/31
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: TANAKA, Mika
田中 実佳
HORI, Keichi
堀 慧地
KAN, Donchoru
姜 東哲
YAMAURA, Masashi
山浦 格
Title: EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE
Abstract:
An epoxy resin composition for sealing, which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, and which is configured such that the inorganic filler contains 75% by mass to 98% by mass of alumina relative to the total mass of the inorganic filler.