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1. (WO2018181571) MOLDING DEVICE

Pub. No.:    WO/2018/181571    International Application No.:    PCT/JP2018/012966
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Mar 29 01:59:59 CEST 2018
IPC: B21D 26/047
B21D 37/16
Applicants: SUMITOMO HEAVY INDUSTRIES, LTD.
住友重機械工業株式会社
Inventors: NOGIWA Kimihiro
野際 公宏
ISHIZUKA Masayuki
石塚 正之
SAIKA Masayuki
雑賀 雅之
UENO Norieda
上野 紀条
IDE Akihiro
井手 章博
KAN Hiroyuki
閑 浩之
Title: MOLDING DEVICE
Abstract:
The molding device according to the present invention is a molding device for expanding a metal pipe material and molding a metal pipe, the molding device provided with a molding die for molding a metal pipe, a first electrode and a second electrode for holding a metal pipe material on both end sides thereof and applying an electric current to heat the metal pipe material, and a first fluid supply part and a second fluid supply part for supplying a fluid into the metal pipe material heated by the first electrode and the second electrode and expanding the metal pipe material, the first electrode and/or the second electrode being provided with a movement restricting mechanism for restricting movement of the metal pipe material in the axial direction of the metal pipe material.