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1. (WO2018181550) PLATING PROCESS CONVEYANCE TAPE BASE MATERIAL, AND PLATING PROCESS CONVEYANCE TAPE

Pub. No.:    WO/2018/181550    International Application No.:    PCT/JP2018/012927
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Mar 29 01:59:59 CEST 2018
IPC: C25D 17/06
H05K 3/18
Applicants: SUMIKASEKISUI FILM CO., LTD.
住化積水フィルム株式会社
Inventors: GOTO, Yasushi
五藤 靖志
Title: PLATING PROCESS CONVEYANCE TAPE BASE MATERIAL, AND PLATING PROCESS CONVEYANCE TAPE
Abstract:
A base material is provided which is suitable for forming a plating process conveyance tape which is used in a process in which a flexible printed circuit board is bonded, conveyed to a plating tank and plated, and which suppresses shrinkage due to heating during the plating process and suppresses the transfer of an adhesive contained in an adhesive layer onto the flexible printed circuit board. Specifically, this base material is used in the formation of a plating process conveyance tape used in a process in which a flexible printed circuit board is bonded, conveyed to a plating tank and plated, and is characterized in that (1) the base material becomes a plating process conveyance tape by applying an adhesive layer, and (2) the base material is a nonstretch film formed from a single layer or multiple layers, and at least one layer contains polybutylene terephthalate and an inorganic filler.