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1. (WO2018181403) HEAT RESISTANT RELEASE SHEET AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/181403 International Application No.: PCT/JP2018/012600
Publication Date: 04.10.2018 International Filing Date: 27.03.2018
IPC:
B32B 27/30 (2006.01) ,B32B 27/00 (2006.01) ,B32B 27/08 (2006.01) ,B32B 27/34 (2006.01) ,H01B 17/56 (2006.01) ,H01L 21/60 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
30
comprising vinyl resin; comprising acrylic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
06
as the main or only constituent of a layer next to another layer of a specific substance
08
of synthetic resin of a different kind
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
34
comprising polyamides
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
17
Insulators or insulating bodies characterised by their form
56
Insulating bodies
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants: NITTO DENKO CORPORATION[JP/JP]; 1-2, Shimohozumi 1-chome, Ibaraki-shi, Osaka 5678680, JP
Inventors: AKIBA Kurato; JP
KUROKI Yuta; JP
Agent: KAMADA Koichi; JP
Priority Data:
2017-06800730.03.2017JP
Title (EN) HEAT RESISTANT RELEASE SHEET AND METHOD FOR MANUFACTURING SAME
(FR) FEUILLE DE PROTECTION AMOVIBLE RÉSISTANT À LA CHALEUR ET SON PROCÉDÉ DE FABRICATION
(JA) 耐熱離型シートとその製造方法
Abstract:
(EN) This heat resistant release sheet has a polyimide substrate and first and second polytetrafluoroethylene (PTFE) layers sandwiching the polyimide substrate. The number average molecular weight of PTFE constituting the first and second PTFE layers is at least 6,000,000, the peel strength required to separate the first PTFE layer from the polyimide substrate is at least 0.5 N/20 mm, and the peel strength required to separate the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. This heat resistant release sheet has a novel configuration, and can better withstand thermocompression bonding at higher temperature.
(FR) La présente invention concerne une feuille de protection amovible résistant à la chaleur dotée d'un substrat de polyimide et de première et seconde couches de polytétrafluoroéthylène (PTFE) prenant en sandwich le substrat de polyimide. Le poids moléculaire moyen en nombre du PTFE constituant les première et seconde couches de PTFE est d'au moins 6 000 000, la résistance au pelage nécessaire pour séparer la première couche de PTFE du substrat de polyimide est d'au moins 0,5 N/20 mm, et la résistance au pelage nécessaire pour séparer la seconde couche de PTFE du substrat de polyimide est inférieure à 0,5 N/20 mm. Cette feuille de protection amovible résistant à la chaleur a une nouvelle configuration, et peut mieux résister à une liaison par thermocompression à une température plus élevée.
(JA) 本開示の耐熱離型シートは、ポリイミド基材と、ポリイミド基材を挟持する第1及び第2のポリテトラフルオロエチレン(PTFE)層とを有する。第1及び第2のPTFE層を構成するPTFEの数平均分子量は600万以上であり、ポリイミド基材から第1のPTFE層を剥離するのに要する剥離力は0.5N/20mm以上であり、第2のPTFE層を剥離するのに要する剥離力は0.5N/20mm未満である。本開示の耐熱離型シートは、新規な構成を有し、より高温での熱圧着にも対応できる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)