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1. (WO2018181384) EPOXY RESIN COMPOSITION, CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
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Pub. No.: WO/2018/181384 International Application No.: PCT/JP2018/012551
Publication Date: 04.10.2018 International Filing Date: 27.03.2018
IPC:
C08G 59/18 (2006.01) ,C08K 3/00 (2018.01) ,C08K 5/54 (2006.01) ,C08L 63/00 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants: HITACHI CHEMICAL COMPANY, LTD.[JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors: YAMAGUCHI, Akemi; JP
NAKADA, Takahiro; JP
NAKAMURA, Shinya; JP
OHSHITA, Tsuyoshi; JP
ENDOU, Yoshinori; JP
Agent: TAIYO, NAKAJIMA & KATO; 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2017-07211831.03.2017JP
2017-07211931.03.2017JP
Title (EN) EPOXY RESIN COMPOSITION, CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
(FR) COMPOSITION DE RÉSINE ÉPOXY, COMPOSITION DE RÉSINE DURCISSABLE ET DISPOSITIF À COMPOSANTS ÉLECTRONIQUES
(JA) エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置
Abstract:
(EN) This epoxy resin composition contains: a monofunctional epoxy compound which has one epoxy group in each molecule; a polyfunctional epoxy compound which has two or more epoxy groups in each molecule; and a curing agent. This curable resin composition contains: a curable resin; a curing agent; and a compound having a (meth)acryloyl group. In addition, this electronic component device is provided with an element that is sealed by means of this epoxy resin composition or this curable resin composition.
(FR) Cette invention concerne une composition de résine époxy contenant : un composé époxy monofonctionnel ayant un groupe époxy par molécule ; un composé époxy polyfonctionnel ayant deux groupes époxy ou plus par molécule ; et un agent durcisseur. La composition de résine durcissable contient : une résine durcissable ; un agent durcisseur ; et un composé ayant un groupe (méth)acryloyle. Un dispositif à composants électroniques comportant un élément qui est scellé à l'aide de ladite composition de résine époxy ou de ladite composition de résine durcissable est en outre décrit.
(JA) エポキシ樹脂組成物は、1分子中にエポキシ基を1個有する単官能エポキシ化合物、1分子中にエポキシ基を2個以上有する多官能エポキシ化合物、及び硬化剤を含有する。硬化性樹脂組成物は、硬化性樹脂、硬化剤、及び(メタ)アクリロイル基を有する化合物を含有する。また電子部品装置は、エポキシ樹脂組成物又は硬化性樹脂組成物により封止された素子を備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)