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1. (WO2018181236) SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/181236    International Application No.:    PCT/JP2018/012278
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Wed Mar 28 01:59:59 CEST 2018
IPC: H01L 23/12
H01L 23/29
H01L 23/36
H01L 23/373
H01L 23/40
Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
パナソニックIPマネジメント株式会社
Inventors: ICHIRYU, Takashi
一柳 貴志
NOMURA, Masanori
野村 雅則
KINOSHITA, Yusuke
木下 雄介
ISHIDA, Hidetoshi
石田 秀俊
YAMADA, Yasuhiro
山田 康博
Title: SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Abstract:
The present invention addresses the problem of providing a semiconductor device in which it is possible to improve heat radiation properties and a method for manufacturing the semiconductor device. A semiconductor device (1) comprises a support substrate (2), a semiconductor chip (3), a resin body (4), and a metal layer (5) for heat radiation. The support substrate (2) has a first surface (21) and a second surface (22) on sides that oppose each other in the thickness direction of the support substrate (2). The semiconductor chip (3) has a plurality of electrodes (35). The semiconductor chip (3) is bonded to the support substrate (2) on the first-surface (21) side of the support substrate (2). The resin body (4) has a first surface (41) and a second surface (42) on sides that oppose each other in the thickness direction of the resin body (4). The resin body (4) covers at least a side surface (23) of the support substrate (2) and a side surface (33) of the semiconductor chip (3). The metal layer (5) for heat radiation is in contact with the support substrate (2) and the resin body (4) so as to cover at least part of the second surface (22) of the support substrate (2) and the second surface (42) of the resin body (4).