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1. (WO2018181190) ELECTROLYTIC SILVER PLATING SOLUTION

Pub. No.:    WO/2018/181190    International Application No.:    PCT/JP2018/012161
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Tue Mar 27 01:59:59 CEST 2018
IPC: C25D 3/46
C25D 3/64
Applicants: METALOR TECHNOLOGIES (JAPAN) CORPORATION
メタローテクノロジーズジャパン株式会社
Inventors: ISEKI, Masato
井関 柾登
Title: ELECTROLYTIC SILVER PLATING SOLUTION
Abstract:
According to the present invention, there is provided an electrolytic silver plating solution containing a silver cyanide complex, an electrically conductive salt, a selenium compound, a saturated fatty acid, and/or a salt thereof, and capable of forming a silver film with a high gloss and a high reflectance.