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1. (WO2018180988) SURFACE TREATMENT FLUID AND SURFACE TREATMENT METHOD FOR ROLLED COPPER FOIL, AND METHOD FOR MANUFACTURING ROLLED COPPER FOIL

Pub. No.:    WO/2018/180988    International Application No.:    PCT/JP2018/011707
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Sat Mar 24 00:59:59 CET 2018
IPC: C23F 1/18
Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC.
三菱瓦斯化学株式会社
Inventors: SONE Masami
曽根 昌彌
MATSUNAGA Hiroshi
松永 裕嗣
TAMAI Satoshi
玉井 聡
Title: SURFACE TREATMENT FLUID AND SURFACE TREATMENT METHOD FOR ROLLED COPPER FOIL, AND METHOD FOR MANUFACTURING ROLLED COPPER FOIL
Abstract:
The present invention relates to a method for manufacturing rolled copper foil, a method for surface treating rolled copper foil, and a surface treatment fluid for rolled copper foil. In the present invention, the surface of the rolled copper foil is treated by dissolution of the rolled copper foil surface by contact of the surface treatment fluid that includes hydrogen peroxide (A), sulfuric acid (B), alcohol (C), and phenylurea (D), in a range of a mole ratio of 0.3 – 3.0 for the hydrogen peroxide (A)/sulfuric acid (B), a range of 0.5 – 15.0% by mass for the sulfuric acid (B), and a range of 0.1 – 5.0% by mass for the alcohol (C), with the rolled copper foil surface. According to a preferable embodiment of the present invention, smoothing of the rolled copper foil surface is possible without giving rise to crater-like etching and pitting.