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1. (WO2018180939) CIRCUIT MODULE

Pub. No.:    WO/2018/180939    International Application No.:    PCT/JP2018/011572
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Sat Mar 24 00:59:59 CET 2018
IPC: H01L 23/28
H01L 23/00
H05K 1/02
H05K 3/28
H05K 9/00
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: NAKAJIMA, Reiji
中嶋 礼滋
Title: CIRCUIT MODULE
Abstract:
The present invention addresses the problem of providing a circuit module in which it is possible to reduce wraparound of noise due to a shield layer, and to improve isolation characteristics between electronic components, while suppressing emission of noise to the outside and infiltration of noise from the outside. A circuit module (100) comprises: electronic components (30); a plurality of conductor posts (40); a mold layer (50) for sealing the plurality of electronic components (30) and the plurality of conductor posts (40); and a shield layer (60) on the mold layer (50). The electronic components (30) include a first electronic component (31) and second electronic components (32, 36). The plurality of conductor posts (40) include a conductor post group (400) that crosses between the first electronic component (31) and the second electronic components (32, 36). For each conductor post (40) of the conductor post group (400), in plan view, the shield layer (60) has a slit (600) extending through between the conductor post (40) and the first electronic component (31), or between the conductor post (40) and the second electronic components (32, 36).