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1. (WO2018180881) BONDING APPARATUS AND BONDING METHOD
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/180881 International Application No.: PCT/JP2018/011382
Publication Date: 04.10.2018 International Filing Date: 22.03.2018
IPC:
H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
株式会社新川 SHINKAWA LTD. [JP/JP]; 東京都武蔵村山市伊奈平2丁目51番地の1 51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo 2088585, JP
Inventors:
渡辺 治 WATANABE Osamu; JP
萩原 美仁 HAGIWARA Yoshihito; JP
中村 智宣 NAKAMURA Tomonori; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
黒木 義樹 KUROKI Yoshiki; JP
小松 秀輝 KOMATSU Hideki; JP
Priority Data:
2017-06759730.03.2017JP
Title (EN) BONDING APPARATUS AND BONDING METHOD
(FR) APPAREIL DE LIAISON ET PROCÉDÉ DE LIAISON
(JA) ボンディング装置及びボンディング方法
Abstract:
(EN) A bonding apparatus 1 which bonds a semiconductor die 102 to a substrate 101 by thermocompression, with an adhesive material 103 being interposed therebetween. This bonding apparatus 1 is provided with: a bonding tool 12 which has a bonding surface 24 that holds the semiconductor die 102, with a first portion R1 of a tape 200 being interposed therebetween, and a pair of first tape constraining surfaces 26A, 26B that are arranged so as to sandwich the bonding surface 24 and constrain a second portion R2 of the tape 200; tape constraining mechanisms 21A, 21B which have a second tape constraining surface 37 that presses the tape 200 against the first tape constraining surfaces 26A, 26B; and a control unit 8 which controls the movements of the bonding tool 12 and the tape constraining mechanisms 21A, 21B.
(FR) L'invention concerne un appareil de liaison 1 qui lie une puce semiconductrice 102 à un substrat 101 par thermocompression, avec un matériau adhésif 103 étant interposé entre ceux-ci. Cet appareil de liaison 1 comprend : un outil de liaison 12 qui a une surface de liaison 24 qui maintient la puce semiconductrice 102, une première partie R1 d'une bande 200 étant interposée entre celles-ci, et une paire de premières surfaces de contrainte de bande 26A, 26B qui sont agencées de façon à prendre en sandwich la surface de liaison 24 et contraignant une seconde partie R2 de la bande 200; des mécanismes de contrainte de bande 21A, 21B qui ont une seconde surface de contrainte de bande 37 qui presse la bande 200 contre les premières surfaces de contrainte de bande 26A, 26B; et une unité de commande 8 qui commande les mouvements de l'outil de liaison 12 et des mécanismes de contrainte de bande 21A, 21B.
(JA) 半導体ダイ102を基板101に接着材料103を介して熱圧着するボンディング装置1である。ボンディング装置1は、テープ200の第1部分R1を介して半導体ダイ102を保持するボンディング面24と、ボンディング面24挟むように配置され、テープ200の第2部分R2を拘束する一対の第1テープ拘束面26A,26Bと、を有するボンディングツール12と、テープ200を第1テープ拘束面26A,26Bに押圧する第2テープ拘束面37を有するテープ拘束機構21A,21Bと、ボンディングツール12及びテープ拘束機構21A,21Bの動作を制御する制御部8と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)