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1. (WO2018180881) BONDING APPARATUS AND BONDING METHOD

Pub. No.:    WO/2018/180881    International Application No.:    PCT/JP2018/011382
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 23 00:59:59 CET 2018
IPC: H01L 21/60
Applicants: SHINKAWA LTD.
株式会社新川
Inventors: WATANABE Osamu
渡辺 治
HAGIWARA Yoshihito
萩原 美仁
NAKAMURA Tomonori
中村 智宣
Title: BONDING APPARATUS AND BONDING METHOD
Abstract:
A bonding apparatus 1 which bonds a semiconductor die 102 to a substrate 101 by thermocompression, with an adhesive material 103 being interposed therebetween. This bonding apparatus 1 is provided with: a bonding tool 12 which has a bonding surface 24 that holds the semiconductor die 102, with a first portion R1 of a tape 200 being interposed therebetween, and a pair of first tape constraining surfaces 26A, 26B that are arranged so as to sandwich the bonding surface 24 and constrain a second portion R2 of the tape 200; tape constraining mechanisms 21A, 21B which have a second tape constraining surface 37 that presses the tape 200 against the first tape constraining surfaces 26A, 26B; and a control unit 8 which controls the movements of the bonding tool 12 and the tape constraining mechanisms 21A, 21B.