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1. (WO2018180671) CIRCUIT DEVICE

Pub. No.:    WO/2018/180671    International Application No.:    PCT/JP2018/010715
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Tue Mar 20 00:59:59 CET 2018
IPC: H05K 7/20
H01L 23/36
H01L 25/07
H01L 25/18
H05K 1/02
Applicants: AUTONETWORKS TECHNOLOGIES, LTD.
株式会社オートネットワーク技術研究所
SUMITOMO WIRING SYSTEMS, LTD.
住友電装株式会社
SUMITOMO ELECTRIC INDUSTRIES, LTD.
住友電気工業株式会社
Inventors: HIRATANI, Shungo
平谷 俊悟
TAHARA, Hideaki
田原 秀哲
HATTORI, Yuuichi
服部 佑一
HARAGUCHI, Akira
原口 章
IKEDA, Jun
池田 潤
NAKAMURA, Arinobu
中村 有延
Title: CIRCUIT DEVICE
Abstract:
In the present invention, a first placement part (23a) of a heat-dissipating body (23) has placed thereon a conductor (22) via an insulating member (24). A FET (4) is electrically connected to the conductor (22). When a current flows across the drain and source of the FET (4), the FET (4) generates heat. A second placement part (25a) of a circuit substrate (25) is placed on the conductor (22). The conductor (22) and the insulating member (24) are interposed between the first placement part (23a) and the second placement part (25a). In the heat-dissipating body (23), a first extension part (23b) extends from the first placement part (23a), and in the circuit substrate (25), a second extension part (25c) extends from the second placement part (25a). The first extension part (23b) faces the second extension part (25c) across a gap, and a microcomputer (51) is placed on the top surface of the first extension part (23b). The microcomputer (51) outputs a control signal that instructs ON or OFF of the FET (4).