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1. (WO2018180545) CYLINDRICAL SPUTTERING TARGET PRODUCTION METHOD AND CYLINDRICAL SPUTTERING TARGET
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/180545 International Application No.: PCT/JP2018/010225
Publication Date: 04.10.2018 International Filing Date: 15.03.2018
IPC:
C23C 14/34 (2006.01) ,B23K 1/20 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
20
Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
Applicants: MITSUBISHI MATERIALS CORPORATION[JP/JP]; 3-2, Otemachi 1-chome, Chiyoda-ku, Tokyo 1008117, JP
Inventors: OKANO Shin; JP
NAGASE Toshiyuki; JP
KATO Shinji; JP
Agent: MATSUNUMA Yasushi; JP
TERAMOTO Mitsuo; JP
HOSOKAWA Fumihiro; JP
ONAMI Kazunori; JP
Priority Data:
2017-06610729.03.2017JP
Title (EN) CYLINDRICAL SPUTTERING TARGET PRODUCTION METHOD AND CYLINDRICAL SPUTTERING TARGET
(FR) PROCÉDÉ DE PRODUCTION DE CIBLE DE PULVÉRISATION CATHODIQUE CYLINDRIQUE ET CIBLE DE PULVÉRISATION CATHODIQUE CYLINDRIQUE
(JA) 円筒型スパッタリングターゲットの製造方法、及び、円筒型スパッタリングターゲット
Abstract:
(EN) The production method for a cylindrical sputtering target according to the present invention comprises: a solder material applying step for forming a solder underlying layer on the inner peripheral surface of a sputtering target material and the outer peripheral surface of a backing tube; a cooling step for cooling the sputtering target material and the backing tube after the solder material applying step; an oxide removing step for removing an oxide produced on the surface of the solder underlying layer; and a solder bonding step for bonding the sputtering target material to the backing tube using a solder.
(FR) La présente invention concerne un procédé de production d'une cible de pulvérisation cathodique cylindrique, comprenant : une étape d'application de matériau de brasure pour former une couche sous-jacente de brasure sur la surface périphérique interne d'un matériau cible de pulvérisation cathodique et la surface périphérique externe d'un tube de support ; une étape de refroidissement pour refroidir le matériau cible de pulvérisation cathodique et le tube de support après l'étape d'application de matériau de brasure ; une étape d'élimination d'oxyde pour éliminer un oxyde produit sur la surface de la couche sous-jacente de brasure ; et une étape d'assemblage par brasure pour assembler le matériau cible de pulvérisation au tube de support à l'aide d'une brasure.
(JA) 本発明の円筒型スパッタリングターゲットの製造方法は、スパッタリングターゲット材の内周面及びバッキングチューブの外周面にはんだ下地層を形成するはんだ材塗布工程と、はんだ材塗布工程後にスパッタリングターゲット材及びバッキングチューブを冷却する冷却工程と、はんだ下地層の表面に生成した酸化物を除去する酸化物除去工程と、スパッタリングターゲット材とバッキングチューブとをはんだ接合するはんだ接合工程と、を備えている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)