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1. (WO2018180451) EPOXY RESIN, PRODUCTION METHOD, AND EPOXY RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
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Pub. No.: WO/2018/180451 International Application No.: PCT/JP2018/009660
Publication Date: 04.10.2018 International Filing Date: 13.03.2018
IPC:
C07D 303/24 (2006.01) ,B29C 70/06 (2006.01) ,C08G 59/20 (2006.01) ,C08J 5/24 (2006.01) ,C08K 3/00 (2018.01) ,C08L 63/00 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,B29K 63/00 (2006.01)
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
303
Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
02
Compounds containing oxirane rings
12
with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
18
by etherified hydroxyl radicals
20
Ethers with hydroxy compounds containing no oxirane rings
24
with polyhydroxy compounds
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
70
Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
04
comprising reinforcements only, e.g. self-reinforcing plastics
06
Fibrous reinforcements only
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20
characterised by the epoxy compounds used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
K
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D103
63
Use of epoxy resins as moulding material
Applicants: DIC CORPORATION[JP/JP]; 35-58, Sakashita 3-chome, Itabashi-ku, Tokyo 1748520, JP
Inventors: YAMOTO Kazuhisa; JP
AKIMOTO Gensuke; JP
NAKAMURA Nobuya; JP
Agent: OGAWA Shinji; JP
Priority Data:
2017-06504929.03.2017JP
Title (EN) EPOXY RESIN, PRODUCTION METHOD, AND EPOXY RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
(FR) RÉSINE ÉPOXY, PROCÉDÉ DE PRODUCTION, COMPOSITION DE RÉSINE ÉPOXY ET OBJET DURCI OBTENU À PARTIR DE CELLE-CI
(JA) エポキシ樹脂、製造方法、エポキシ樹脂組成物及びその硬化物
Abstract:
(EN) The present invention addresses the problem of providing: an epoxy resin which is excellent in terms of flowability and curability, gives cured objects having satisfactory moisture resistance and mechanical strength, and is suitable for use in applications such as semiconductor encapsulants and circuit boards; a production method for the epoxy resin; an epoxy resin composition containing the epoxy resin; and a cured object formed from the epoxy resin composition. Specifically, provided are: an epoxy resin (A) which comprises, as a main component, an epoxidized dihydroxybenzene optionally having a C1-8 alkyl group as a substituent on the aromatic ring, characterized by showing a maximum peak when examined by GPC, the maximum peak having an areal proportion of 90% or higher; a production method for the epoxy resin; an epoxy resin composition containing the epoxy resin; and a cured object formed from the epoxy resin composition.
(FR) La présente invention aborde le problème consistant à fournir : une résine époxy qui est excellente en termes d'aptitude à l'écoulement et de durcissement, donne des objets durcis ayant une résistance à l'humidité et une résistance mécanique satisfaisantes, et est appropriée pour être utilisée dans des applications telles que des produits d'encapsulation de semi-conducteur et des cartes de circuit imprimé; un procédé de production de la résine époxy; une composition de résine époxy contenant la résine époxy; et un objet durci formé à partir de la composition de résine époxy. L'invention concerne particulièrement, une résine époxy (A) qui comprend, en tant que composant principal, un dihydroxybenzène époxydé ayant éventuellement un groupe alkyle en C1-8 en tant que substituant sur l'anneau aromatique, caractérisé en ce qu'il présente un pic maximal lorsqu'il est examiné par GPC, le pic maximal ayant une proportion surfacique de 90 % ou plus; l'invention concerne en outre un procédé de production de la résine époxy; une composition de résine époxy contenant la résine époxy; et un objet durci formé à partir de la composition de résine époxy.
(JA) 流動性、硬化性に優れ、得られる硬化物の耐湿性、機械強度も良好であり、半導体封止材料、回路基板等に好適に用いることができるエポキシ樹脂、その製造方法、および当該エポキシ樹脂を含有するエポキシ樹脂組成物とその硬化物を提供することを課題とする。具体的には、芳香環上の置換基として炭素数1~8のアルキル基を有していてもよいジヒドロキシベンゼンのエポキシ化物を主成分とするエポキシ樹脂(A)であって、GPC測定における最大ピークの面積比率が90%以上であることを特徴とするエポキシ樹脂、その製造方法、これを用いるエポキシ樹脂組成物、及びその硬化物である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)