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1. (WO2018180340) PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE
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Pub. No.: WO/2018/180340 International Application No.: PCT/JP2018/009015
Publication Date: 04.10.2018 International Filing Date: 08.03.2018
IPC:
H01L 41/319 (2013.01) ,H01L 41/047 (2006.01) ,H01L 41/113 (2006.01) ,H01L 41/187 (2006.01) ,H01L 41/316 (2013.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22
Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
31
Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base
314
by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing
319
using intermediate layers, e.g. for growth control
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
04
of piezo-electric or electrostrictive elements
047
Electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08
Piezo-electric or electrostrictive elements
113
with mechanical input and electrical output
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
16
Selection of materials
18
for piezo-electric or electrostrictive elements
187
Ceramic compositions
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22
Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
31
Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base
314
by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing
316
by vapour phase deposition
Applicants:
日東電工株式会社 NITTO DENKO CORPORATION [JP/JP]; 大阪府茨木市下穂積1丁目1番2号 1-1-2, Shimohozumi, Ibaraki-shi, Osaka 5678680, JP
Inventors:
有本 将治 ARIMOTO, Masaharu; JP
待永 広宣 MACHINAGA, Hironobu; JP
▲葛▼田 真郷 KATSUDA, Masato; JP
黒瀬 愛美 KUROSE, Manami; JP
Agent:
伊東 忠重 ITOH, Tadashige; JP
伊東 忠彦 ITOH, Tadahiko; JP
Priority Data:
2017-06554729.03.2017JP
Title (EN) PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE
(FR) DISPOSITIF PIÉZOÉLECTRIQUE ET PROCÉDÉ DE FABRICATION DE DISPOSITIF PIÉZOÉLECTRIQUE
(JA) 圧電デバイス、及び圧電デバイスの製造方法
Abstract:
(EN) Provided are: a piezoelectric device which is provided with a flexible plastic layer and has excellent piezoelectric properties, and in which cracking or fracture is suppressed; and a method for manufacturing the same. This piezoelectric device has stacked therein, at least a first electrode, a plastic layer, an orientation control layer, a piezoelectric layer, and a second electrode, wherein the orientation control layer is amorphous, the piezoelectric layer, which has a thickness of 20-250 nm and a wurtzite-type crystal structure, is formed on the orientation control layer, and the orientation control layer and the piezoelectric layer are disposed between the first electrode and the second electrode.
(FR) L'invention concerne : un dispositif piézoélectrique qui comprend une couche de plastique souple et qui présente d'excellentes propriétés piézoélectriques, et dans lequel la fissuration ou la fracture est supprimée; et un procédé de fabrication de celui-ci. A l’intérieur ce dispositif piézoélectrique est empilé, au moins une première électrode, une couche plastique, une couche de commande d'orientation, une couche piézoélectrique et une seconde électrode, la couche de commande d'orientation étant amorphe, la couche piézoélectrique, qui a une épaisseur de 20 à 250 nm et une structure cristalline de type wurtzite, est formée sur la couche de commande d'orientation, et la couche de commande d'orientation et la couche piézoélectrique sont disposées entre la première électrode et la seconde électrode.
(JA) 屈曲性を有するプラスチック層を有し、かつ、良好な圧電特性を備え、クラックまたは割れが抑制された、圧電デバイスとその製造方法を提供する。少なくとも、第1電極、プラスチック層、配向制御層、圧電体層、及び第2電極が積層された圧電デバイスにおいて、前記配向制御層は非晶質であり、前記配向制御層の上に、ウルツ鉱型の結晶構造を有する厚さ20nm~250nmの圧電体層が形成されており、前記配向制御層と前記圧電体層が、前記第1電極と前記第2電極の間に配置されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)