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1. (WO2018180324) MULTI-DIE TEMPERATURE CONTROL DEVICE AND METHOD FOR CONTROLLING TEMPERATURE OF MULTI-DIE POWER MODULE

Pub. No.:    WO/2018/180324    International Application No.:    PCT/JP2018/008879
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 02 00:59:59 CET 2018
IPC: G01K 3/06
H02M 1/32
Applicants: MITSUBISHI ELECTRIC CORPORATION
MITSUBISHI ELECTRIC R&D CENTRE EUROPE B.V.
Inventors: EWANCHUK, Jeffrey
BRANDELERO, Julio
Title: MULTI-DIE TEMPERATURE CONTROL DEVICE AND METHOD FOR CONTROLLING TEMPERATURE OF MULTI-DIE POWER MODULE
Abstract:
The present invention concerns a method for controlling the temperature of a multi-die power module comprising plural dies, a multi-die temperature control device receiving an input signal and driving independantly the dies of the multi-die power module. The multi-die temperature control: - obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, - obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, - compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, - reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.