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1. (WO2018180178) ELECTRONIC COMPONENT
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/180178 International Application No.: PCT/JP2018/007820
Publication Date: 04.10.2018 International Filing Date: 01.03.2018
IPC:
H01L 23/12 (2006.01) ,H01F 27/06 (2006.01) ,H01F 27/29 (2006.01) ,H01G 2/06 (2006.01) ,H01L 25/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27
Details of transformers or inductances, in general
06
Mounting, supporting, or suspending transformers, reactors, or choke coils
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27
Details of transformers or inductances, in general
28
Coils; Windings; Conductive connections
29
Terminals; Tapping arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
2
Details of capacitors not covered by a single one of groups H01G4/-H01G11/112
02
Mountings
06
specially adapted for mounting on a printed-circuit support
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
松本 翔 MATSUMOTO, Sho; JP
Agent:
吉川 修一 YOSHIKAWA, Shuichi; JP
傍島 正朗 SOBAJIMA, Masaaki; JP
Priority Data:
2017-06765730.03.2017JP
Title (EN) ELECTRONIC COMPONENT
(FR) COMPOSANT ÉLECTRONIQUE
(JA) 電子部品
Abstract:
(EN) An electronic component (1) is provided with: a substrate (10) having mounting components (22, 24) that are mounted on a first main surface; a recessed section (12) that is provided in a recessed shape in a second main surface of the substrate (10), said second main surface being on the reverse side of the first main surface; an inner electrode (14) that is disposed at least on a part of the bottom surface of the recessed section (12); a plurality of outer electrodes (16) that are disposed on a part of a peripheral section (13) of the second main surface, said peripheral section excluding the recessed section (12); and a first separation section (30), i.e., an exposed peripheral section (13), between the outer electrodes (16) and the recessed section (12).
(FR) Un composant électronique (1) est pourvu : d'un substrat (10) ayant des composants de montage (22, 24) qui sont montés sur une première surface principale ; d'une section évidée (12) qui est disposée dans une forme évidée dans une seconde surface principale du substrat (10), ladite seconde surface principale étant sur le côté inverse de la première surface principale ; d'une électrode interne (14) qui est disposée au moins sur une partie de la surface inférieure de la section évidée (12) ; d'une pluralité d'électrodes externes (16) qui sont disposées sur une partie d'une section périphérique (13) de la seconde surface principale, ladite section périphérique excluant la section évidée (12) ; et d'une première section de séparation (30), à savoir, une section périphérique exposée (13), entre les électrodes externes (16) et la section évidée (12).
(JA) 電子部品(1)は、第1主面に実装部品(22)および(24)が実装される基板(10)と、基板(10)の第1主面と対向する第2主面に凹状に設けられた凹部(12)と、凹部(12)の底面の少なくとも一部に配置された内側電極(14)と、第2主面の凹部(12)以外の周辺部(13)の一部に複数配置された外側電極(16)と、外側電極(16)と凹部(12)との間に、周辺部(13)が露出した第1の分離部(30)とを備えている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)