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1. (WO2018180159) METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEAT SINK

Pub. No.:    WO/2018/180159    International Application No.:    PCT/JP2018/007605
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Mar 01 00:59:59 CET 2018
IPC: H01L 23/36
H01L 23/12
H01L 23/373
H05K 1/02
H05K 7/20
Applicants: MITSUBISHI MATERIALS CORPORATION
三菱マテリアル株式会社
Inventors: YUMOTO Ryouhei
湯本 遼平
OOHIRAKI Tomoya
大開 智哉
KITAHARA Takeshi
北原 丈嗣
NAGATOMO Yoshiyuki
長友 義幸
Title: METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEAT SINK
Abstract:
This production method produces an insulated circuit board (40) with a heat sink, said insulated circuit board being provided with: an insulated circuit board (10) wherein a circuit layer (12) and a metal layer (13) are formed on an insulating layer (11); and a heat sink (41) that is bonded to the metal layer (13) side. The metal layer (13) is configured from aluminum or an aluminum alloy, and has an indentation hardness of less than 50 mgf/μm2. The heat sink (41) has a bonding surface that is configured from aluminum or an aluminum alloy and is bonded to the insulated circuit board (10). This method comprises: an aluminum bonding layer formation step S02 wherein an aluminum bonding layer (31) that is formed of aluminum or an aluminum alloy having a solidus temperature of 650°C or less is formed on the metal layer (13); and a heat sink bonding step S30 wherein a copper bonding material (32) that is formed of copper or a copper alloy is laminated between the aluminum bonding layer (31) and the heat sink (41), and the aluminum bonding layer (31), the copper bonding material (32) and the heat sink (41) are bonded with each other by solid-phase diffusion.