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1. (WO2018180054) SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

Pub. No.:    WO/2018/180054    International Application No.:    PCT/JP2018/006407
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Feb 23 00:59:59 CET 2018
IPC: H01L 21/308
C23F 1/46
H01L 21/304
H01L 21/306
Applicants: SCREEN HOLDINGS CO., LTD.
株式会社SCREENホールディングス
Inventors: YAMAGUCHI, Yuji
山口 侑二
KIMURA, Masahiro
基村 雅洋
KISHIDA, Takuya
岸田 拓也
SUGIOKA, Shinji
杉岡 真治
Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Abstract:
This substrate processing method comprises: a mixed acid heating step of heating a mixed acid comprising a mixture solution of phosphoric acid, nitric acid, and water; a molar ratio adjusting step of decreasing a P/W molar ratio (the number of moles of phosphoric acid included in the mixed acid/ the number of moles of water included in the mixed acid) by adding water to the mixed acid, in order to maintain the P/W molar ratio between a molar ratio upper-limit value and a molar ratio lower-limit value; and an etching step of etching a metal film on a substrate by supplying the mixed acid to which water has been added onto the substrate.