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|1. (WO2018180054) SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE|
|Applicants:||SCREEN HOLDINGS CO., LTD.
|Title:||SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE|
This substrate processing method comprises: a mixed acid heating step of heating a mixed acid comprising a mixture solution of phosphoric acid, nitric acid, and water; a molar ratio adjusting step of decreasing a P/W molar ratio (the number of moles of phosphoric acid included in the mixed acid/ the number of moles of water included in the mixed acid) by adding water to the mixed acid, in order to maintain the P/W molar ratio between a molar ratio upper-limit value and a molar ratio lower-limit value; and an etching step of etching a metal film on a substrate by supplying the mixed acid to which water has been added onto the substrate.