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1. (WO2018180018) SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND PROGRAM RECORDING MEDIUM

Pub. No.:    WO/2018/180018    International Application No.:    PCT/JP2018/005987
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Wed Feb 21 00:59:59 CET 2018
IPC: H01L 21/304
H01L 21/683
Applicants: SCREEN HOLDINGS CO., LTD.
株式会社SCREENホールディングス
Inventors: NISHIDA, Takayuki
西田 崇之
ISHII, Junichi
石井 淳一
Title: SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND PROGRAM RECORDING MEDIUM
Abstract:
A substrate processing device for brush-cleaning a substrate. The substrate processing device is provided with: a spin base provided so as to be capable of rotating about a rotation axis; a spin base rotation mechanism for rotating the spin base; and a plurality of first chuck pins capable of being switched between an open state and a closed state, the first chuck pins being configured so as to be capable of clamping the end parts of the substrate from the side surfaces thereof in a closed state and being provided to the spin base. Each of the plurality of first chuck pins is configured such that, in the closed state in which the first chuck pin clamps the end part of the substrate, the upper surface of the first chuck pin is at the same height as or lower than the upper surface of the substrate.