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1. (WO2018179819) TEMPORARY-FIXING SUBSTRATE AND METHOD FOR MOLDING ELECTRONIC COMPONENT

Pub. No.:    WO/2018/179819    International Application No.:    PCT/JP2018/003404
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Feb 02 00:59:59 CET 2018
IPC: H01L 21/02
H01L 21/56
Applicants: NGK INSULATORS, LTD.
日本碍子株式会社
Inventors: NOMURA Masaru
野村 勝
MIYAZAWA Sugio
宮澤 杉夫
Title: TEMPORARY-FIXING SUBSTRATE AND METHOD FOR MOLDING ELECTRONIC COMPONENT
Abstract:
A temporary-fixing substrate 2 provided with: a fixing surface 1A for adhering a plurality of electronic components 6 and temporarily fixing the plurality of electronic components 6 using a resin mold 7; and a bottom surface 3B disposed on the opposite side from the fixing surface. The temporary-fixing substrate 2 comprises a light transmissive ceramic, scratches are dispersed over the fixing surface 1A, and a polished surface and a grain boundary of crystal particles constituting the light transmissive ceramic are exposed on the bottom surface. The bottom surface has a scratch density lower than a scratch density on the fixing surface.