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1. (WO2018179796) THERMAL-BONDING SHEET AND THERMAL-BONDING SHEET-ATTACHED DICING TAPE
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Pub. No.: WO/2018/179796 International Application No.: PCT/JP2018/003005
Publication Date: 04.10.2018 International Filing Date: 30.01.2018
IPC:
H01L 21/52 (2006.01) ,C09J 1/00 (2006.01) ,C09J 7/00 (2018.01) ,C09J 7/20 (2018.01) ,C09J 133/04 (2006.01) ,C09J 169/00 (2006.01) ,H01L 21/301 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
1
Adhesives based on inorganic constituents
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
[IPC code unknown for C09J 7/20]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04
Homopolymers or copolymers of esters
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
169
Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants:
日東電工株式会社 NITTO DENKO CORPORATION [JP/JP]; 大阪府茨木市下穂積1丁目1番2号 1-2, Shimohozumi 1-chome, Ibaraki-shi, Osaka 5678680, JP
Inventors:
菅生悠樹 SUGO, Yuki; JP
本田哲士 HONDA, Satoshi; JP
下田麻由 SHIMODA, Mayu; JP
Agent:
特許業務法人後藤特許事務所 GOTO & CO.; 大阪府大阪市北区紅梅町2番18号 2-18, Kobai-cho, Kita-ku, Osaka-shi, Osaka 5300038, JP
Priority Data:
2017-06450129.03.2017JP
Title (EN) THERMAL-BONDING SHEET AND THERMAL-BONDING SHEET-ATTACHED DICING TAPE
(FR) FEUILLE DE LIAISON THERMIQUE ET BANDE DE DÉCOUPAGE EN DÉS FIXÉE À UNE FEUILLE DE LIAISON THERMIQUE
(JA) 加熱接合用シートおよび加熱接合用シート付きダイシングテープ
Abstract:
(EN) [Problem] To provide a thermal-bonding sheet suitable for achieving sinter bonding while suppressing misalignment of an object to be bonded, and a dicing tape comprising such a thermal-bonding sheet. [Solution] A thermal-bonding sheet (10) of the present invention is provided with an adhesive layer (11) comprising conductive metal-containing sinterable particles, wherein the adhesive layer (11) has a shear bond strength of not less than 0.1 MPa at 70°C with respect to a silver plane having a 5 mm square size of the adhesive layer (11) pressure-bonded thereto under pressure-bonding conditions of 70°C, 0.5 MPa, and one second. A thermal-bonding sheet-attached dicing tape of the present invention is provided with a dicing tape having a stacked structure including a base material and an adhesive agent layer, and a thermal-bonding sheet (10) on the adhesive agent layer.
(FR) Le problème décrit par la présente invention est de fournir une feuille de liaison thermique appropriée pour réaliser une liaison par frittage tout en supprimant un mauvais alignement d'un objet à lier, et une bande de découpage en dés comprenant une telle feuille de liaison thermique. La solution selon l'invention porte sur une feuille de liaison thermique (10) qui est pourvue d'une couche adhésive (11) comprenant des particules frittables contenant un métal conducteur, la couche adhésive (11) ayant une force de liaison de cisaillement d'au moins 0,1 MPa à 70 °C par rapport à un plan d'argent ayant une dimension de 5 mm carrés de la couche adhésive (11) qui y est liée par pression dans des conditions de liaison par pression de 70 °C, 0,5 MPa et une seconde. Une bande de découpage en dés fixée à une feuille de liaison thermique de la présente invention est pourvue d'une bande de découpage en dés ayant une structure empilée comprenant un matériau de base et une couche d'agent adhésif, et d'une feuille de liaison thermique (10) sur la couche d'agent adhésif.
(JA) 【課題】接合対象物の位置ずれを抑制しつつ焼結接合を実現するのに適した加熱接合用シート、および、そのような加熱接合用シートを伴うダイシングテープを、提供する。 【解決手段】本発明の加熱接合用シート(10)は、導電性金属含有の焼結性粒子を含む粘着層(11)を備え、70℃、0.5MPa、および1秒間の圧着条件にて粘着層(11)が5mm角のサイズで圧着された銀平面に対する当該粘着層(11)の70℃でのせん断接着力が0.1MPa以上である。本発明の加熱接合用シート付きダイシングテープは、基材および粘着剤層を含む積層構造を有するダイシングテープと、粘着剤層上の加熱接合用シート(10)とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)