Search International and National Patent Collections

1. (WO2018179787) POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD

Pub. No.:    WO/2018/179787    International Application No.:    PCT/JP2018/002788
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Tue Jan 30 00:59:59 CET 2018
IPC: H01L 21/304
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: IWANO Tomohiro
岩野 友洋
MATSUMOTO Takaaki
松本 貴彬
HASEGAWA Tomoyasu
長谷川 智康
Title: POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD
Abstract:
Provided is a polishing liquid which comprises abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a fluid medium, wherein the abrasive grains have a positive zeta potential, and the cationic compound has a weight average molecular weight of less than 1,000.