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1. (WO2018179682) COPPER FOIL HAVING ADHESIVE AGENT ADHERED THERETO, COPPER-CLAD LAMINATED PLATE, AND WIRING SUBSTRATE
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Pub. No.: WO/2018/179682 International Application No.: PCT/JP2018/000824
Publication Date: 04.10.2018 International Filing Date: 15.01.2018
IPC:
H05K 3/38 (2006.01) ,B32B 15/08 (2006.01) ,B32B 15/20 (2006.01) ,C09J 4/00 (2006.01) ,C09J 7/20 (2018.01) ,C09J 11/06 (2006.01) ,C09J 153/02 (2006.01) ,C09J 171/00 (2006.01) ,H05K 1/03 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
20
comprising aluminium or copper
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
[IPC code unknown for C09J 7/20]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
153
Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
02
Vinyl aromatic monomers and conjugated dienes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
171
Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
内田 一路 UCHIDA Kazumichi; JP
Agent:
特許業務法人サクラ国際特許事務所 SAKURA PATENT OFFICE, P.C.; 東京都千代田区内神田一丁目18番14号 ヨシザワビル Yoshizawa Bldg., 18-14, Uchikanda 1-chome, Chiyoda-ku, Tokyo 1010047, JP
Priority Data:
2017-06328328.03.2017JP
Title (EN) COPPER FOIL HAVING ADHESIVE AGENT ADHERED THERETO, COPPER-CLAD LAMINATED PLATE, AND WIRING SUBSTRATE
(FR) FEUILLE DE CUIVRE SUR LAQUELLE EST COLLÉ UN AGENT ADHÉSIF, PLAQUE STRATIFIÉE REVÊTUE DE CUIVRE ET SUBSTRAT DE CÂBLAGE
(JA) 接着剤付き銅箔、銅張積層板および配線基板
Abstract:
(EN) Provided are: a wiring substrate having a low dielectric constant and a low dielectric tangent; and a copper foil having an adhesive agent adhered thereto and a copper-clad laminated plate, each of which is suitable for the production of the wiring substrate and is improved in the adhesion to a copper foil. A copper foil having an adhesive agent adhered thereto, which comprises a copper foil and an adhesive agent layer provided on one surface of the copper foil, wherein the copper foil has, on one surface thereof, a roughened surface of which the surface is treated with methacryl silane, acryl silane or isocyanurate silane, the adhesive agent layer is made of a resin composition containing, as the main component, a modified polyphenylene ether in which a hydroxyl group located at an end of the main chain is modified with an ethylenically unsaturated compound, and the adhesive agent layer is formed on the roughened surface.
(FR) L'invention concerne : un substrat de câblage présentant une faible constante diélectrique et une faible tangente diélectrique ; et une feuille de cuivre sur laquelle est collé un agent adhésif et une plaque stratifiée revêtue de cuivre, le tout étant approprié pour la production du substrat de câblage et présentant une adhérence améliorée à une feuille de cuivre. L'invention concerne donc une feuille de cuivre sur laquelle est collé un agent adhésif, qui comprend une feuille de cuivre et une couche d'agent adhésif disposée sur une surface de la feuille de cuivre, la feuille de cuivre comportant, sur l'une de ses surfaces, une surface rugueuse dont la surface est traitée à l'aide de méthacrylsilane, d'acrylsilane ou d'isocyanurate silane, la couche d'agent adhésif étant constituée d'une composition de résine contenant, en tant que composant principal, un éther de polyphénylène modifié dans lequel un groupe hydroxy situé à une extrémité de la chaîne principale est modifié à l'aide d'un composé éthylénique insaturé, et la couche d'agent adhésif étant située sur la surface rugueuse.
(JA) 低誘電率および低誘電正接を有する配線基板、その製造に好適で、銅箔との接着性が改善された接着剤付き銅箔、銅張積層板を提供する。銅箔と、該銅箔の片面に設けられた接着剤層と、を有する接着剤付き銅箔であって、この銅箔は、片面に、メタクリルシラン、アクリルシランまたはイソシアヌレートシランで表面処理されてなる粗化面を有し、前記接着剤層は、主鎖の末端に存在するヒドロキシル基がエチレン性不飽和化合物で変性された変性ポリフェニレンエーテルを主成分とする樹脂組成物からなり、かつ、前記粗化面上に形成されている、接着剤付き銅箔。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)