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|1. (WO2018179655) MOLD RELEASING FILM AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD|
|Applicants:||NIPPON MEKTRON, LTD.
|Title:||MOLD RELEASING FILM AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD|
Provided is a mold releasing film capable of favorably preventing a break thereof due to the spread of an end side of a cushion layer. A mold releasing film 30 used when laminating a cover film 20 onto a base laminated body 10 having an insulating resin layer 11 and a pattern layer 12 is provided with: a base layer 31 that is mainly composed of a polyester-based resin; a cushion layer 33 that is mainly composed of an olefin-based resin and that, by means of heating and pressurization, follows irregularities of the cover film 20 and the base laminated body 10 while covering the cover film 20; and an adhesive layer 32 that attaches the cushion layer 33 to the base layer 31 and includes a trap part 34 exposed to protrude from an end side of the cushion layer 33.