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1. (WO2018179655) MOLD RELEASING FILM AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

Pub. No.:    WO/2018/179655    International Application No.:    PCT/JP2017/047063
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Dec 28 00:59:59 CET 2017
IPC: B29C 63/02
B29C 33/68
B32B 27/00
H05K 3/46
Applicants: NIPPON MEKTRON, LTD.
日本メクトロン株式会社
Inventors: TANAKA, Hideaki
田中 秀明
TANIKAWA, Yuto
谷川 優人
YASUDA, Shoji
安田 勝司
HIRATSUKA, Kiyoshi
平塚 喜吉
NAKASHIMA, Masashi
中島 正志
Title: MOLD RELEASING FILM AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
Abstract:
Provided is a mold releasing film capable of favorably preventing a break thereof due to the spread of an end side of a cushion layer. A mold releasing film 30 used when laminating a cover film 20 onto a base laminated body 10 having an insulating resin layer 11 and a pattern layer 12 is provided with: a base layer 31 that is mainly composed of a polyester-based resin; a cushion layer 33 that is mainly composed of an olefin-based resin and that, by means of heating and pressurization, follows irregularities of the cover film 20 and the base laminated body 10 while covering the cover film 20; and an adhesive layer 32 that attaches the cushion layer 33 to the base layer 31 and includes a trap part 34 exposed to protrude from an end side of the cushion layer 33.