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1. (WO2018179640) PHOTOSENSITIVE TRANSFERRING MATERIAL AND METHOD FOR PRODUCING CIRCUIT WIRING
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/179640 International Application No.: PCT/JP2017/046478
Publication Date: 04.10.2018 International Filing Date: 25.12.2017
IPC:
G03F 7/11 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/039 (2006.01) ,H05K 3/06 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
09
characterised by structural details, e.g. supports, auxiliary layers
11
having cover layers or intermediate layers, e.g. subbing layers
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
藤本 進二 FUJIMOTO, Shinji; JP
佐藤 守正 SATO, Morimasa; JP
片山 晃男 KATAYAMA, Akio; JP
漢那 慎一 KANNA, Shinichi; JP
篠田 克己 SHINODA, Katsumi; JP
Agent:
特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO; 東京都新宿区新宿4丁目3番17号 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2017-06804230.03.2017JP
2017-20857127.10.2017JP
Title (EN) PHOTOSENSITIVE TRANSFERRING MATERIAL AND METHOD FOR PRODUCING CIRCUIT WIRING
(FR) MATÉRIAU DE TRANSFERT PHOTOSENSIBLE ET PROCÉDÉ DE PRODUCTION DE CÂBLAGE DE CIRCUIT
(JA) 感光性転写材料、及び、回路配線の製造方法
Abstract:
(EN) This photosensitive transferring material comprises a temporary support, an intermediate layer, and a photosensitive resin composition layer in this order. The photosensitive resin composition layer includes: a polymer including a constituent unit including an acid group protected by an acid-degradable group; and a photoacid generator. The intermediate layer is water-soluble or alkali-soluble, and includes a resin C including a constituent unit including a phenolic hydroxyl group or an alcoholic hydroxyl group that is not directly bonded to the main chain. Also provided is a method for producing a circuit wiring using said photosensitive transferring material.
(FR) L'invention concerne un matériau de transfert photosensible qui comprend un support temporaire, une couche intermédiaire et une couche de composition de résine photosensible, dans cet ordre. La couche de composition de résine photosensible comprend : un polymère comprenant une unité constitutive comprenant un groupe acide protégé par un groupe dégradable par acide ; et un générateur de photoacide. La couche intermédiaire est hydrosoluble ou soluble dans les alcalis, et comprend une résine C comprenant une unité constitutive comprenant un groupe hydroxyle phénolique ou un groupe hydroxyle alcoolique qui n'est pas directement lié à la chaîne principale. L'invention concerne également un procédé de production d'un câblage de circuit à l'aide dudit matériau de transfert photosensible.
(JA) 感光性転写材料は、仮支持体と、中間層と、感光性樹脂組成物層とをこの順で有し、上記感光性樹脂組成物層が、酸分解性基で保護された酸基を有する構成単位を有する重合体と、光酸発生剤とを含有し、上記中間層が、水溶性又はアルカリ可溶性であり、かつフェノール性水酸基又は主鎖に直結していないアルコール性水酸基を有する構成単位を含む樹脂Cを含有する。また、上記感光性転写材料を用いた回路配線の製造方法が提供される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)