Search International and National Patent Collections

1. (WO2018179395) HOT STAMPED MOLDING

Pub. No.:    WO/2018/179395    International Application No.:    PCT/JP2017/013760
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Sat Apr 01 01:59:59 CEST 2017
IPC: C23C 2/12
C21D 1/18
C21D 9/00
C22C 18/04
C22C 21/10
C22C 38/00
C22C 38/06
C22C 38/58
C23C 2/28
C23C 2/40
Applicants: NIPPON STEEL & SUMITOMO METAL CORPORATION
新日鐵住金株式会社
Inventors: SENGOKU, Akihiro
仙石 晃大
TAKEBAYASHI, Hiroshi
竹林 浩史
AKIOKA, Koji
秋岡 幸司
MATSUMURA, Kenichiro
松村 賢一郎
Title: HOT STAMPED MOLDING
Abstract:
A hot stamped molding provided with a base metal 10 and a plating layer 20 formed on the surface of the base metal 10, wherein: the plating layer 20 comprises an interfacial layer 21, an intermediate layer 22 and an oxide layer 23, in that order starting from the side of the base metal 10; the structure of the interfacial layer 21 comprises at least one kind of Fe-Al alloy selected from αFe, Fe3Al and FeAl and the total area ratio of the Fe-Al alloy is at least 99%; the intermediate layer 22 comprises at least one kind of Fe-Al-Zn phase selected from Fe(Al,Zn)2, Fe2(Al,Zn)5 and Fe(Al,Zn)3 and the total area percentage of the Fe-Al-Zn phases is at least 50%; the mean composition, in mass%, comprises Al: 30-50% and Zn: 15-30%; and the mean film thickness of the oxide layer 23 is 3.0 µm or less and the Mg content is 0.05-0.50 g/m2.