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1. (WO2018179315) ELECTRONIC COMPONENT MOUNTING MACHINE AND MOUNTING METHOD

Pub. No.:    WO/2018/179315    International Application No.:    PCT/JP2017/013540
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Sat Apr 01 01:59:59 CEST 2017
IPC: H05K 3/34
H05K 13/08
Applicants: FUJI CORPORATION
株式会社FUJI
Inventors: TAKAHASHI, Akira
高橋 明
Title: ELECTRONIC COMPONENT MOUNTING MACHINE AND MOUNTING METHOD
Abstract:
To provide an electronic component mounting machine and a mounting method wherein an appropriate amount of viscous fluid can be transferred to bumps. The electronic component mounting machine comprises: a reservoir unit that reserves viscous fluid; a head unit that holds an electronic component having bumps and immerses the bumps of the electronic component into the viscous fluid; an illumination unit that illuminates the bumps to which the viscous fluid has been transferred; an image capture unit that captures an image of the bumps illuminated by the illumination unit; and a control device. The control device executes: a detection process of detecting, on the basis of image data obtained by the image capture performed by the image capture unit, a transferred amount of the viscous fluid transferred to the bumps; a determination process of determining whether the transferred amount is good or not; and a transfer process of transferring viscous fluid to the bumps in response to the transferred amount being less than a predetermined threshold value.