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1. (WO2018179295) EXPOSURE APPARATUS AND METHOD, AND DEVICE MANUFACTURING METHOD

Pub. No.:    WO/2018/179295    International Application No.:    PCT/JP2017/013477
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 31 01:59:59 CEST 2017
IPC: G03F 7/20
H01L 21/67
Applicants: NIKON CORPORATION
株式会社ニコン
Inventors: SATO Shinji
佐藤 真路
FUNATSU Takayuki
舩津 貴行
ICHINOSE Go
一ノ瀬 剛
Title: EXPOSURE APPARATUS AND METHOD, AND DEVICE MANUFACTURING METHOD
Abstract:
This exposure apparatus is for exposing a wafer, held by a shuttle, to an electron beam, and is provided with: a movable stage to which the shuttle holding the wafer is detachably attached; an electrostatic attracting device that electrostatically attracts the wafer to the shuttle; and a gas supply device that supplies a gas to a space between the shuttle and the wafer during at least a portion of a period when the wafer is attracted by the electrostatic attracting device. The present invention can suppress damage to a substrate and generation of out-of-place objects from the substrate caused by the attraction when the substrate is attracted and held while the substrate is conveyed or exposed.