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1. (WO2018179260) PHOTOSENSITIVE RESIN COMPOSITION, PATTERN CURED FILM, METHOD FOR MANUFACTURING PATTERN CURED FILM, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
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Pub. No.: WO/2018/179260 International Application No.: PCT/JP2017/013343
Publication Date: 04.10.2018 International Filing Date: 30.03.2017
IPC:
H05K 3/28 (2006.01) ,C08G 59/17 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
14
Polycondensates modified by chemical after-treatment
16
by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof
17
by acrylic or methacrylic acid
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Applicants: HITACHI CHEMICAL COMPANY, LTD.[JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors: IRIZAWA Shinji; JP
YOSHINO Toshizumi; JP
TANAKA Shigeo; JP
FUSE Yoshiaki; JP
DAIJIMA Yuta; JP
KOMURO Nobuhito; JP
KOJIMA Masayuki; JP
Agent: MINAKAWA Kazuyasu; JP
Priority Data:
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, PATTERN CURED FILM, METHOD FOR MANUFACTURING PATTERN CURED FILM, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM DURCI À MOTIF AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, ÉLÉMENT PHOTOSENSIBLE, ET CARTE DE CIRCUIT IMPRIMÉ AINSI QUE PROCÉDÉ DE FABRICATION DE CELLE-CI
(JA) 感光性樹脂組成物、パターン硬化膜及びその製造方法、感光性エレメント、並びに、プリント配線板及びプリント配線板の製造方法
Abstract:
(EN) Provided is a photosensitive resin composition which exhibits excellent adhesion to a substrate even under extreme curing conditions, and can improve warpage even when used for forming a permanent mask resist of a thin printed wiring board. The photosensitive resin composition contains an acid modified vinyl group-containing epoxy resin (A), a photopolymerizable monomer (B) having an ethylenically unsaturated bond, a photopolymerization initiator (C), an inorganic filler (D), and a melamine compound-containing curing agent (E), wherein the content of the inorganic filler (D) is 30-60 mass% of the total solid content in the photosensitive resin composition, and the content of the curing agent (E) is 75-140 parts by mass per 100 parts by mass of the acid modified vinyl group-containing epoxy resin (A).
(FR) L’invention fournit une composition de résine photosensible qui permet une amélioration en termes de gauchissement mise en œuvre dans la formation d’une réserve de masque permanent pour carte de circuit imprimé de type mince, et qui est dotée d’une excellente adhérence vis-à-vis d’un substrat, y compris dans des conditions de durcissement rigoureuses. Plus précisément, l’invention concerne une composition de résine photosensible qui comprend une résine époxy comprenant un groupe vinyle modifié par un acide (A), un monomère photopolymérisable (B) possédant une liaison éthyléniquement insaturée, un initiateur de photopolymérisation (C), une charge inorganique (D), et un agent de durcissement (E) comprenant un composé mélamine. La teneur en charge inorganique (D), est comprise entre 30 et 60% en masse de la quantité totale de matière solide contenue dans la composition de résine photosensible. La teneur en agent de durcissement (E) est comprise entre 75 et 140 parties en masse pour 100 parties en masse de résine époxy comprenant un groupe vinyle modifié par un acide (A).
(JA) 薄型のプリント配線板の永久マスクレジストの形成に用いても反りを改善することができ、かつ、硬化条件を厳しくしても基板との密着性に優れる感光性樹脂組成物を提供する。 (A)酸変性ビニル基含有エポキシ樹脂、(B)エチレン性不飽和結合を有する光重合性モノマー、(C)光重合開始剤、(D)無機フィラー及び(E)メラミン化合物を含有する硬化剤、を含有してなる感光性樹脂組成物であって、(D)無機フィラーの含有量が、感光性樹脂組成物中の固形分全量の30~60質量%であり、(E)硬化剤の含有量が、(A)酸変性ビニル基含有エポキシ樹脂100質量部あたり75~140質量部である感光性樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)