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1. (WO2018179064) SLURRY AND POLISHING METHOD

Pub. No.:    WO/2018/179064    International Application No.:    PCT/JP2017/012428
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Tue Mar 28 01:59:59 CEST 2017
IPC: H01L 21/304
C09K 3/14
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: IWANO Tomohiro
岩野 友洋
Title: SLURRY AND POLISHING METHOD
Abstract:
Provided is a slurry that comprises abrasive grains and a liquid medium, wherein: the abrasive grains include a first particle and a second particle that is in contact with the first particle; and the first particle contains ceria and has a negative zeta potential, while the second particle contains a hydroxide of a tetravalent metal element and has a positive zeta potential.