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|1. (WO2018178821) ELECTRONIC DEVICES INCLUDING SOLID SEMICONDUCTOR DIES|
|Applicants:||3M INNOVATIVE PROPERTIES COMPANY
PEKUROVSKY, Mikhail L.
STAY, Matthew S.
DODDS, Shawn C.
METZLER, Thomas J.
SMITH, Matthew R. D.
SHAH, Saagar A.
LEE, Jae Yong
POCH, James F.
BARTON, Roger W.
|Title:||ELECTRONIC DEVICES INCLUDING SOLID SEMICONDUCTOR DIES|
Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.