Search International and National Patent Collections

1. (WO2018178821) ELECTRONIC DEVICES INCLUDING SOLID SEMICONDUCTOR DIES

Pub. No.:    WO/2018/178821    International Application No.:    PCT/IB2018/051949
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 23 00:59:59 CET 2018
IPC: H01L 35/32
H01L 35/24
Applicants: 3M INNOVATIVE PROPERTIES COMPANY
Inventors: MAHAJAN, Ankit
PEKUROVSKY, Mikhail L.
STAY, Matthew S.
DODDS, Shawn C.
METZLER, Thomas J.
SMITH, Matthew R. D.
SHAH, Saagar A.
LEE, Jae Yong
POCH, James F.
BARTON, Roger W.
Title: ELECTRONIC DEVICES INCLUDING SOLID SEMICONDUCTOR DIES
Abstract:
Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.