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1. (WO2018178022) METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE STRUCTURES ON A CARRIER MATERIAL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/178022 International Application No.: PCT/EP2018/057662
Publication Date: 04.10.2018 International Filing Date: 26.03.2018
IPC:
C25D 5/56 (2006.01) ,C23C 18/20 (2006.01) ,C08K 3/32 (2006.01) ,H05K 1/03 (2006.01) ,C08J 3/28 (2006.01) ,B41M 5/26 (2006.01) ,C23C 18/16 (2006.01) ,C23C 18/18 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54
Electroplating of non-metallic surfaces
56
of plastics
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
20
of organic surfaces, e.g. resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
32
Phosphorus-containing compounds
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3
Processes of treating or compounding macromolecular substances
28
Treatment by wave energy or particle radiation
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
M
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
5
Duplicating or marking methods; Sheet materials for use therein
26
Thermography
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
Applicants: CHEMISCHE FABRIK BUDENHEIM KG[DE/DE]; Rheinstraße 27 55257 Budenheim, DE
Inventors: FÜNDERICH, Sven; DE
GARCIA MARTINEZ, David; ES
FUTTERER, Thomas; DE
LITTERSCHEID, Christian; DE
WISSEMBORSKI, Rüdiger; DE
FLORES, Jorge; DE
Agent: WEBER, Roland; DE
LIEKE, Winfried; DE
SIEBERT, Karsten; DE
HIORT, Jan; DE
KÖPPEN, Manfred; DE
Priority Data:
10 2017 106 913.530.03.2017DE
Title (EN) METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE STRUCTURES ON A CARRIER MATERIAL
(FR) PROCÉDÉ DE FABRICATION DE STRUCTURES ÉLECTRIQUEMENT CONDUCTRICES SUR UN MATÉRIAU DE SUBSTRAT
(DE) VERFAHREN ZUR HERSTELLUNG VON ELEKTRISCH LEITENDEN STRUKTUREN AUF EINEM TRÄGERMATERIAL
Abstract:
(EN) The invention relates to a method for producing electrically conductive structures, preferably conducting track structures, by means of laser light on a non-conductive carrier material (LDS method), characterized in that a non-conductive carrier material is provided, which contains at least one inorganic metal phosphate compound and at least one stabilizer finely distributed or dissolved in said carrier material, and the carrier material is irradiated in regions by means of laser light, the electrically conductive structures thus being produced in the irradiated regions.
(FR) La présente invention concerne un procédé de fabrication de structures électriquement conductrices, de préférences des structures de pistes conductrices, au moyen d'un rayonnement laser sur un matériau de substrat non conducteur (procédé LDS: Laser Direct Structuring), caractérisé en ce qu'on prépare un matériau de substrat non conducteur contenant au moins un composé phosphate métallique inorganique finement dispersé ou dissous et au moins un stabilisateur, et en ce qu'on expose certaines zones du matériau de substrat à un rayonnement laser pour former les structures électriquement conductrices dans les zones exposées.
(DE) Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung von elektrisch leitenden Strukturen, vorzugsweise Leiterbahnstrukturen, mittels Laserlicht auf einem nichtleitenden Trägermaterial (LDS-Verfahren), dadurch gekennzeichnet, dass man ein nichtleitendes Trägermaterial bereitstellt, welches darin fein verteilt oder gelöst wenigstens eine anorganische Metall-Phosphat-Verbindung und wenigstens einen Stabilisator enthält, das Trägermaterial in Bereichen mittels Laserlicht bestrahlt unter Erzeugung der elektrisch leitenden Strukturen in den bestrahlten Bereichen.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)