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1. (WO2018177341) SILICON CHIP HOLDING DEVICE, SILICON CHIP CONVEYING DEVICE, SILICON CHIP DELIVERY SYSTEM AND CONVEYING METHOD

Pub. No.:    WO/2018/177341    International Application No.:    PCT/CN2018/080976
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 30 01:59:59 CEST 2018
IPC: H01L 21/677
H01L 21/683
H01L 21/687
Applicants: SHANGHAI MICRO ELECTRONICS EQUIPMENT(GROUP) CO., LTD.
上海微电子装备(集团)股份有限公司
Inventors: WANG, Gang
王刚
ZHANG, Rongjun
张荣军
JIANG, Xiaoyu
姜晓玉
SHI, Yichao
施益超
LIU, Kai
刘凯
CHEN, Junpeng
陈俊朋
Title: SILICON CHIP HOLDING DEVICE, SILICON CHIP CONVEYING DEVICE, SILICON CHIP DELIVERY SYSTEM AND CONVEYING METHOD
Abstract:
Provided are a silicon chip holding device (1), a silicon chip conveying device, a silicon chip delivery system and a conveying method. The silicon chip holding device (1) is installed at the silicon chip conveying device. The silicon chip holding device (1) comprises a holding device main body (11) and a chuck device (12). The holding device main body has a first opening (111). The chuck device comprises a first skirt structure (121) positioned at one side of the holding device main body and connected to the first opening. A groove structure (112) is arranged at where the first skirt structure is connected to the first opening. The groove structure (112) is positioned at an outer side of the first skirt structure. Arrangement of a groove structure at an outer side of the first skirt structure (121) where the first skirt structure is connected to the first opening can release stress applied to a root portion of the chuck device due to deformation of the first skirt structure.