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1. (WO2018177007) LASER-ETCHED GRAIN-ORIENTED SILICON STEEL RESISTANT TO STRESS RELIEF/ANNEALING AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/177007    International Application No.:    PCT/CN2018/074023
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Jan 25 00:59:59 CET 2018
IPC: C21D 8/12
Applicants: BAOSHAN IRON & STEEL CO., LTD.
宝山钢铁股份有限公司
Inventors: ZHAO, Zipeng
赵自鹏
LI, Guobao
李国保
YANG, Yongjie
杨勇杰
WU, Meihong
吴美洪
MA, Changsong
马长松
JI, Yaming
吉亚明
LING, Chen
凌晨
XIE, Weiyong
谢伟勇
GUO, Jianguo
郭建国
Title: LASER-ETCHED GRAIN-ORIENTED SILICON STEEL RESISTANT TO STRESS RELIEF/ANNEALING AND MANUFACTURING METHOD THEREFOR
Abstract:
A laser-etched grain-oriented silicon steel resistant to stress relief/annealing and a manufacturing method therefor. Parallel line-shaped grooves (20) are formed on one or both sides of grain-oriented silicon steel (10) by laser etching. The line-shaped grooves (20) are perpendicular to, or at an angle to, a rolling direction of a steel plate. A maximum height of edge protrusions of the line-shaped grooves (20) does not exceed 5 μm, and a maximum height of spatter in etch-free regions between adjacent line-shaped grooves (20) does not exceed 5 μm, and the proportion of an area occupied by spatter in the vicinity of the line-shaped grooves (20) does not exceed 5%. The steel has low manufacturing costs, and the product etching effect is retained during a stress relief/annealing process, suitable for manufacturing of wound core transformers.