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1. (WO2018176306) SUBSTRATE CLEANING APPARATUS
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Pub. No.: WO/2018/176306 International Application No.: PCT/CN2017/078732
Publication Date: 04.10.2018 International Filing Date: 30.03.2017
IPC:
B08B 1/04 (2006.01) ,B08B 3/02 (2006.01) ,B08B 7/04 (2006.01) ,H01L 21/304 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
1
Cleaning by methods involving the use of tools, brushes, or analogous members
04
using rotary operative members
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3
Cleaning by methods involving the use or presence of liquid or steam
02
Cleaning by the force of jets or sprays
B PERFORMING OPERATIONS; TRANSPORTING
08
CLEANING
B
CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
7
Cleaning by methods not provided for in a single other subclass or a single group in this subclass
04
by a combination of operations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
ACM RESEARCH (SHANGHAI) INC. [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-tech Park Shanghai 201203, CN
Inventors:
WANG, Hui; CN
WU, Jun; CN
CHENG, Cheng; CN
WANG, Xi; CN
CHU, Zhenming; CN
Agent:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC; 435 Guiping Road Shanghai 200233, CN
Priority Data:
Title (EN) SUBSTRATE CLEANING APPARATUS
(FR) APPAREIL DE NETTOYAGE DE SUBSTRAT
Abstract:
(EN) A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (107,207), and an ultra or mega sonic device (206,306). The chuck assembly is configured to receive and clamp a substrate. The at least one first nozzle (107,207) is configured to spray liquid onto the top surface of the substrate. The ultra or mega sonic device (206,306) is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate. A gap is formed between the ultra or mega sonic device (206,306) and the top surface of the substrate, and the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device (206,306) is filled with the liquid all the time during the cleaning process.
(FR) La présente invention concerne un appareil de nettoyage de substrat, comprenant un ensemble mandrin, au moins une première buse (107 207), et un dispositif ultra ou méga-sonique (206, 306). L'ensemble mandrin est conçu pour recevoir et fixer un substrat. L'au moins une première buse (107, 207) est conçue pour pulvériser un liquide sur la surface supérieure du substrat. Le dispositif ultra- ou méga- sonique (206, 306) est conçu pour être disposé au-dessus de la surface supérieure du substrat pour fournir un nettoyage ultra- ou méga-sonique au substrat. Un espace est formé entre le dispositif ultra- ou méga-sonique (206, 306) et la surface supérieure du substrat, et l'espace est rempli entièrement et en continu avec le liquide de telle sorte que la totalité de la partie inférieure du dispositif ultra-ou méga-sonique (206, 306) est remplie du liquide tout au long du processus de nettoyage.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)