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1. (WO2018166269) LIGHT EMITTING DIODE FILAMENT AND LAMP
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/166269 International Application No.: PCT/CN2017/118824
Publication Date: 20.09.2018 International Filing Date: 27.12.2017
IPC:
H01L 25/075 (2006.01) ,H01L 33/62 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants: ZHEJIANG DINGXIN ARTS & CRAFTS CO., LTD.[CN/CN]; 21#, Linxian Rd., Baishuiyang Industrial Park Linhai, Zhejiang 317000, CN
Inventors: XIANG, Chen; CN
Agent: BEIJING INDUSTRY & INFORMATION INTELLECTUAL PROPERTY COMPANY LIMITED; GUO, Yifei B706, B908, Caizhi International Building Zhongguancun East Road No. 18, Haidian District Beijing 100083, CN
Priority Data:
201710145266.913.03.2017CN
Title (EN) LIGHT EMITTING DIODE FILAMENT AND LAMP
(FR) FILAMENT DE DIODE ÉLECTROLUMINESCENTE ET LAMPE
(ZH) 一种发光二极管灯丝及一种灯具
Abstract:
(EN) Provided is an LED filament, comprising multiple LED chips (50), a first support (10), and a second support (20). The LED chips (50) are connected and fixed to the first support (10) and/or the second support (20). The first support (10) and the second support (20) are made of metal. Both ends of the LED chips (50) are electrically connected to the first support (10) and the second support (20) respectively, or the multiple LED chips (50) are divided into multiple groups of LED chips connected in series. Both ends of each group of LED chips connected in series are electrically connected to the first support (10) and the second support (20) respectively.
(FR) L'invention concerne un filament de DEL, comprenant de multiples puces de DEL (50), un premier support (10) et un second support (20). Les puces de DEL (50) sont connectées et fixées au premier support (10) et/ou au second support (20). Le premier support (10) et le second support (20) sont en métal. Les deux extrémités des puces de DEL (50) sont électriquement connectées au premier support (10) et au second support (20) respectivement, ou les multiples puces de DEL (50) sont divisées en de multiples groupes de puces de DEL connectées en série. Les deux extrémités de chaque groupe de puces de DEL connectées en série sont connectées électriquement au premier support (10) et au second support (20) respectivement.
(ZH) 提供一种LED灯丝,包括多个LED芯片(50)、第一支架(10)和第二支架(20),LED芯片(50)与第一支架(10)和/或第二支架(20)连接固定,第一支架(10)和第二支架(20)由金属制成;LED芯片(50)两端分别与第一支架(10)和第二支架(20)电连接,或多个LED芯片(50)分成多组相互串联的LED芯片,每组相互串联的LED芯片两端分别与第一支架(10)和第二支架(20)电连接。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)