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1. (WO2018165533) HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS TECHNICAL FIELD

Pub. No.:    WO/2018/165533    International Application No.:    PCT/US2018/021715
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Sat Mar 10 00:59:59 CET 2018
IPC: H01L 21/67
Applicants: APPLIED MATERIALS, INC.
Inventors: LIANG, Qiwei
NEMANI, Srinivas D.
KHAN, Adib
KASIBHOTLA, Venkata Ravishankar
MALIK, Sultan
KANG, Sean S.
WONG, Keith Tatseun
Title: HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS TECHNICAL FIELD
Abstract:
A high-pressure processing system for processing a substrate includes a first chamber, a pedestal positioned within the first chamber to support the substrate, a second chamber adjacent the first chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, and a gas delivery system configured to introduce a processing gas into the first chamber and to increase the pressure within the first chamber to at least 10 atmospheres while the processing gas is in the first chamber and while the first chamber is isolated from the second chamber.