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1. (WO2018165292) BOLTLESS SUBSTRATE SUPPORT ASSEMBLY
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Pub. No.: WO/2018/165292 International Application No.: PCT/US2018/021333
Publication Date: 13.09.2018 International Filing Date: 07.03.2018
IPC:
H01L 21/683 (2006.01) ,H01L 21/67 (2006.01) ,H01L 21/68 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
Applicants:
LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway Fremont, California 94538, US
Inventors:
HAO, Fangli; US
FU, Yuehong; US
CHEN, Zhigang; US
Agent:
CHAPP, Jeffrey J.; US
AMBROSE, John; US
AQUINO, Damian M.; US
BARNETT, Scott D.; US
BENSON, Tyson B.; US
BERBERICH, Jeanette M.; US
BRENNAN, Michael P.; US
BROCK, Christopher M.; US
CASTELLANO, John A. III; US
CHANG, Alex C.; US
CUTLER, Matthew L.; US
DALEY, Donald J.; US
DELASSUS, Gregory S.; US
DOERR, Michael P.; US
DOWDY, Stephanie L.; US
DRYSDALE, Nicholas S.; US
ELCHUK, Mark D.; US
ERJAVAC, Stanley M.; US
FALCOFF, Monte L.; US
FITZPATRICK, John W.; US
FORBIS, Glenn E.; US
FOSS, Stephen J.; US
FRANKLIN, Clarence C.; US
FRENTRUP, Mark A.; US
FULLER, III, Roland A.,; US
FUSSNER, Anthony G.; US
HEIST, Jason A.; US
HILTON, Michael E.; US
HOYT, Blair D.; US
KELLER, Paul A.; US
KESKAR, Hemant M.; US
KORAL, Elizabeth; US
KOTSIS, Damian H.; US
LAFATA, Joseph M.; US
LEE, Kisuk; US
LUCHSINGER, James B.; US
MACINTYRE, Timothy D.; US
MALINZAK, Michael; US
MARTIN, Timothy J.; US
MASSEY, Ryan W.; US
MEYER, Greg W.; US
MIERZWA, Kevin G.; US
MILLER, H. Keith; US
MOUSTAKAS, George D.; US
NABI, Tarik M.; US
NYE, Michael R.; US
OLSON, Stephen T.; US
PANKA, Brian G.; US
RAKERS, Leanne; US
ROBINSON, Douglas A.; US
SCHIVLEY, G. Gregory; US
SCHMIDT, Michael J.; US
SEITZ, Brent G.; US
SIMINSKI, Robert M.; US
SMITH, Corey E.; US
SMITH, Michael L.; US
SNYDER, Jeffrey L.; US
STOBBS, Gregory A.; US
STRAUSS, Ryan N.; US
SUTER, David L.; US
TAYLOR, Michael L.; US
TAYLOR, W.R. Duke; US
TEICH, Michael L.; US
THOMAS, Michael J.; US
TUCKER, JR., David J.; US
UTYKANSKI, David P.; US
VARCO, Michael A.; US
WADE, Bryant E.; US
WALKER, Donald G.; US
WALSH, Joseph E., Jr.; US
WANGEROW, Steven D.; US
WARNER, Richard W.; US
WAXMAN, Andrew M.; US
WELCH, Gerald T.; US
WHEELOCK, Bryan K.; US
WIGGINS, Michael D.; US
WOODSIDE WOJTALA, Jennifer; US
YACURA, Gary D.; US
ZALOBSKY, Michael D.; US
Priority Data:
15/452,97608.03.2017US
Title (EN) BOLTLESS SUBSTRATE SUPPORT ASSEMBLY
(FR) ENSEMBLE SUPPORT DE SUBSTRAT SANS BOULON
Abstract:
(EN) A substrate support includes a conductive baseplate arranged to support a ceramic layer. The conductive baseplate includes a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate. A coupling assembly is arranged within the first cavity. The coupling assembly includes a gear configured to rotate about the axis. A pin arranged within the first cavity extends along the axis through the gear and into a second cavity below the conductive baseplate. Rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate. The pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity.
(FR) L'invention concerne un support de substrat comprenant une plaque de base conductrice agencée pour supporter une couche de céramique. La plaque de base conductrice comprend une première cavité s'étendant le long d'un axe perpendiculaire à un plan horizontal défini par la plaque de base conductrice. Un ensemble de couplage est disposé à l'intérieur de la première cavité. L'ensemble de couplage comprend un engrenage conçu pour tourner autour de l'axe. Une broche disposée à l'intérieur de la première cavité s'étend le long de l'axe à travers l'engrenage et dans une seconde cavité au-dessous de la plaque de base conductrice. La rotation de l'engrenage amène la broche à se déplacer vers le haut ou vers le bas par rapport à la plaque de base conductrice. La broche est retenue à l'intérieur de la seconde cavité lorsque l'engrenage est tourné pour amener la broche à se déplacer vers le bas dans la seconde cavité.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)