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1. (WO2018165016) INTEGRATED ELECTRICAL AND OPTOELECTRONIC PACKAGE

Pub. No.:    WO/2018/165016    International Application No.:    PCT/US2018/020907
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Tue Mar 06 00:59:59 CET 2018
IPC: G02B 6/42
H05K 1/00
Applicants: CORNING OPTICAL COMMUNICATIONS LLC
Inventors: EVANS, Alan Frank
MATISS, Andreas
WIMMER, Michael
Title: INTEGRATED ELECTRICAL AND OPTOELECTRONIC PACKAGE
Abstract:
An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.