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1. (WO2018164671) AN ANISOTROPY THERMALLY CONDUCTIVE MATERIAL BASED THERMAL INTERFACE PADS
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Pub. No.: WO/2018/164671 International Application No.: PCT/US2017/021106
Publication Date: 13.09.2018 International Filing Date: 07.03.2017
IPC:
H01L 23/373 (2006.01) ,H01L 23/367 (2006.01) ,H05K 7/20 (2006.01) ,F28F 21/02 (2006.01) ,B32B 3/26 (2006.01) ,B32B 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
F
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
21
Constructions of heat-exchange apparatus characterised by the selection of particular materials
02
of carbon, e.g. graphite
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
3
Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form
26
characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
9
Layered products essentially comprising a particular substance not covered by groups B32B11/-B32B29/137
Applicants:
JONES TECH INC. [US/US]; 918 Leighton Way Sunnyvale, CA 94087, US
Inventors:
WU, Xiaoning; CN
Agent:
XU, Yue; US
Priority Data:
Title (EN) AN ANISOTROPY THERMALLY CONDUCTIVE MATERIAL BASED THERMAL INTERFACE PADS
(FR) TAMPONS D'INTERFACE THERMIQUE À BASE DE MATÉRIAU THERMOCONDUCTEUR À ANISOTROPIE
Abstract:
(EN) Disclosed is an anisotropic thermal interface pad structure for increasing heat conductivity between heat spreader and heat source of an electronic device. The anisotropic thermal interface pad structure includes an anisotropic thermally conductive film and a carrier polymer material for holding the anisotropic thermally conductive film. The anisotropic thermally conductive film fills the air gap between the heat spreader and the heat source. The anisotropic thermally conductive film is configured in zig-zag layers structure to achieve high thermal conductivity throughout the components of the electronic device. Further, each layer of the zig-zag structure of anisotropic film is perforated to achieve inter-connection. The inter-connection improves the compression ratio of the anisotropic film.
(FR) L'invention concerne une structure de tampon d'interface thermique anisotrope permettant d'augmenter la conductivité thermique entre un dissipateur thermique et une source de chaleur d'un dispositif électronique. La structure de tampon d'interface thermique anisotrope comprend un film thermoconducteur anisotrope et un matériau polymère de support permettant de maintenir le film thermoconducteur anisotrope. Le film thermoconducteur anisotrope remplit l'entrefer entre le dissipateur thermique et la source de chaleur. Le film thermoconducteur anisotrope est conçu selon une structure de couches en zigzag pour obtenir une conductivité thermique élevée dans tous les composants du dispositif électronique. En outre, chaque couche de la structure en zigzag du film anisotrope est perforée pour réaliser une inter-connexion. L'interconnexion améliore le taux de compression du film anisotrope.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)