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|1. (WO2018164217) LIGHT-SENSITIVE RESIN COMPOSITION, ETCHING METHOD, AND PLATING METHOD|
|Applicants:||MITSUBISHI PAPER MILLS LIMITED
|Title:||LIGHT-SENSITIVE RESIN COMPOSITION, ETCHING METHOD, AND PLATING METHOD|
A light-sensitive resin composition containing (A) an alkali-soluble resin, (B) a photopolymerization initiator, and (C) an acrylate monomer, and which may further contain (D) a methacrylate monomer. The (C) acrylate monomer contains (C1) a double bond equivalent amount of 250 or more of the acrylate monomer and (C2) a double bond equivalent amount of 150 or less of the acrylate monomer. The content of the (D) methacrylate monomer is 0-5 mass% of the (C) acrylate monomer, the content of the (C1) double bond equivalent of 250 or more of the acrylate monomer being 40-60 mass%, the content of the (C2) double bond equivalent amount of 150 or less of the acrylate monomer is 40-60 mass%, and the content of the (B) photopolymerization initiator is 0.5-1.5 mass% of the light-sensitive resin composition. The present invention further provides an etching method and a plating method using the light-sensitive resin composition.