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1. (WO2018164217) LIGHT-SENSITIVE RESIN COMPOSITION, ETCHING METHOD, AND PLATING METHOD

Pub. No.:    WO/2018/164217    International Application No.:    PCT/JP2018/008940
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Fri Mar 09 00:59:59 CET 2018
IPC: G03F 7/027
C08F 2/48
C08F 2/50
C08F 290/06
C08J 7/04
G03F 7/031
H05K 3/06
H05K 3/18
Applicants: MITSUBISHI PAPER MILLS LIMITED
三菱製紙株式会社
Inventors: IRISAWA, Munetoshi
入澤 宗利
KAJIYA, Kunihito
梶谷 邦人
TOYODA, Yuji
豊田 裕二
Title: LIGHT-SENSITIVE RESIN COMPOSITION, ETCHING METHOD, AND PLATING METHOD
Abstract:
A light-sensitive resin composition containing (A) an alkali-soluble resin, (B) a photopolymerization initiator, and (C) an acrylate monomer, and which may further contain (D) a methacrylate monomer. The (C) acrylate monomer contains (C1) a double bond equivalent amount of 250 or more of the acrylate monomer and (C2) a double bond equivalent amount of 150 or less of the acrylate monomer. The content of the (D) methacrylate monomer is 0-5 mass% of the (C) acrylate monomer, the content of the (C1) double bond equivalent of 250 or more of the acrylate monomer being 40-60 mass%, the content of the (C2) double bond equivalent amount of 150 or less of the acrylate monomer is 40-60 mass%, and the content of the (B) photopolymerization initiator is 0.5-1.5 mass% of the light-sensitive resin composition. The present invention further provides an etching method and a plating method using the light-sensitive resin composition.