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1. (WO2018164160) MODULE

Pub. No.:    WO/2018/164160    International Application No.:    PCT/JP2018/008682
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Thu Mar 08 00:59:59 CET 2018
IPC: H01L 23/29
H01L 23/12
H01L 23/31
H01L 25/00
H01L 25/07
H01L 25/18
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: MORIMOTO, Yuta
森本 裕太
NOMURA, Tadashi
野村 忠志
KUSUNOKI, Motohiko
楠 元彦
KOMATSU, Toru
小松 了
Title: MODULE
Abstract:
Provided is a module which is capable of achieving reduction in height, while improving heat dissipation effect. A module 1 according to the present invention is provided with: a substrate 2; a first component 3 which generates heat, while being mounted on one main surface 2a of the substrate 2; a second component 4 which is mounted on the main surface 2a of the substrate 2, and wherein the temperature increase during operation is smaller than the temperature increase of the first component 3 during operation; a metal block 6 which is connected to an opposite surface 3a of the first component 3, said opposite surface being on the reverse side of a facing surface that faces the main surface 2a, and to an opposite surface 4a of the second component 4, said opposite surface being on the reverse side of a facing surface that faces the main surface 2a; and a sealing resin layer 7 which seals the main surface 2a, the first component 3, the second component 4 and the metal block 6. The height from the main surface 2a to the highest surface 8a of the metal block 6 is lower than the height from the main surface 2a to the highest surface 7a of the sealing resin layer 7.