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|1. (WO2018164160) MODULE|
|Applicants:||MURATA MANUFACTURING CO., LTD.
Provided is a module which is capable of achieving reduction in height, while improving heat dissipation effect. A module 1 according to the present invention is provided with: a substrate 2; a first component 3 which generates heat, while being mounted on one main surface 2a of the substrate 2; a second component 4 which is mounted on the main surface 2a of the substrate 2, and wherein the temperature increase during operation is smaller than the temperature increase of the first component 3 during operation; a metal block 6 which is connected to an opposite surface 3a of the first component 3, said opposite surface being on the reverse side of a facing surface that faces the main surface 2a, and to an opposite surface 4a of the second component 4, said opposite surface being on the reverse side of a facing surface that faces the main surface 2a; and a sealing resin layer 7 which seals the main surface 2a, the first component 3, the second component 4 and the metal block 6. The height from the main surface 2a to the highest surface 8a of the metal block 6 is lower than the height from the main surface 2a to the highest surface 7a of the sealing resin layer 7.