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1. (WO2018163999) METAL CLAD LAMINATED PLATE, CIRCUIT BOARD, AND MULTI-LAYER CIRCUIT BOARD

Pub. No.:    WO/2018/163999    International Application No.:    PCT/JP2018/008072
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Sat Mar 03 00:59:59 CET 2018
IPC: B32B 15/08
C09J 125/08
C09J 163/00
H05K 1/03
H05K 3/46
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: OHASHI, Kazuhiko
大橋 和彦
FUKUTAKE, Sunao
福武 素直
EDA, Takeshi
枝 武史
Title: METAL CLAD LAMINATED PLATE, CIRCUIT BOARD, AND MULTI-LAYER CIRCUIT BOARD
Abstract:
The purpose of the present invention is to provide: a metal clad laminated plate in which bonding strength between a liquid-crystal polymer film and a metal foil is high even if surface roughness of the metal foil is low, a transmission loss is low in a high-frequency region, and the problem of warpage or oozing of an adhesive is reduced; a circuit board in which a circuit is formed on the metal clad laminated plate; a multi-layer circuit board in which a plurality of the metal clad laminated plates formed with a circuit are laminated; and an electronic component including the multi-layer circuit board and a mother board. The metal clad laminated plate according to the present invention includes a liquid-crystal polymer film, an adhesive layer, and a metal foil. The adhesive layer and the metal foil are laminated in this order on one side of the liquid-crystal polymer film. The adhesive layer has a thickness of 0.5 μm or more and 4.0 μm or less. The adhesive layer has a dynamic magnification value of 1.15 or more. The adhesive layer has a loss tangent value of 0.16 or less when a distortion ratio is 0.06% under the application of a periodic distortion of 1 Hz. A surface of the metal foil on a side thereof contacting the adhesive layer has a substantial roughened height of 0.4 μm or less.